Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 2/20 | 0.36 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.31 |
| ▸ | FDPS | P14324 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL708162 | 0.98 | DNM1 (0.39) | DNM1OPRM1LMNACA2SMPD1 | |
| SCHEMBL702434 | 0.98 | DNM1 (0.39) | DNM1OPRM1LMNACA2SMPD1 | |
| SCHEMBL713161 | 0.96 | OPRM1 (0.34) | DNM1OPRM1LMNASMPD1FDPS | |
| SCHEMBL705786 | 0.96 | DNM1 (0.36) | DNM1OPRM1LMNACA2SMPD1 | |
| SCHEMBL707568 | 0.96 | DNM1 (0.33) | DNM1 | |
| SCHEMBL704163 | 0.94 | DNM1 (0.39) | DNM1OPRM1LMNACA2SMPD1 | |
| SCHEMBL702102 | 0.94 | LMNA (0.35) | DNM1OPRM1LMNASMPD1FDPS | |
| SCHEMBL704550 | 0.94 | DNM1 (0.39) | DNM1OPRM1LMNACA2SMPD1 | |
| SCHEMBL705226 | 0.93 | CTSK (0.33) | DNM1 | |
| SCHEMBL702775 | 0.93 | DNM1 (0.37) | DNM1OPRM1LMNACA2SMPD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |