SCHEMBL706873

SCHEMBL706873

c1ccc([SiH](CCC[SiH](c2ccccc2)c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CALM1 P0DP23 1/20 0.38
HTR2A P28223 1/20 0.32
HRH1 P35367 1/20 0.32
KCNA3 P22001 1/20 0.32
ALDH1A1 P00352 2/20 0.31
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703363 0.94 HTR2A (0.32) CALM1HTR2AHRH1KCNA3ALDH1A1
SCHEMBL706709 0.88 CALM1 (0.35) CALM1ALDH1A1
SCHEMBL114779 0.85 LTA4H (0.38)
SCHEMBL28871248 0.85 ALDH1A1 (0.39) ALDH1A1
SCHEMBL11515460 0.83 TDP1 (0.36) ALDH1A1MAPT
SCHEMBL11515611 0.83 TDP1 (0.36) ALDH1A1
SCHEMBL8680276 0.83 HDAC3 (0.42)
SCHEMBL2454765 0.83 SIGMAR1 (0.46) HTR2AALDH1A1
SCHEMBL416285 0.83 LTA4H (0.38)
SCHEMBL561211 0.81 DNM1 (0.40) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed