Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 1/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.55 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.42 |
| ▸ | HDAC4 | P56524 | 2/20 | 0.42 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.42 |
| ▸ | HDAC7 | Q8WUI4 | 2/20 | 0.42 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.42 |
| ▸ | HDAC10 | Q969S8 | 2/20 | 0.42 |
| ▸ | HDAC11 | Q96DB2 | 2/20 | 0.42 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.42 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.42 |
| ▸ | HDAC9 | Q9UKV0 | 2/20 | 0.42 |
| ▸ | HDAC5 | Q9UQL6 | 2/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | CES1 | P23141 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7057370 | 0.83 | HDAC3 (0.52) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL17681414 | 0.83 | MAPT (0.59) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL728471 | 0.81 | KCNN4 (0.67) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL728468 | 0.81 | MAPT (0.57) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL9034523 | 0.81 | MAPT (0.57) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL7056401 | 0.80 | KCNN4 (0.46) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL704699 | 0.80 | KCNN4 (0.46) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| Ammonia Solution, Strong SCHEMBL11249050 | 0.79 | KCNN4 (0.64) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| SCHEMBL27868527 | 0.79 | MAPT (0.61) | MAPTKMT2AKCNN4CYP2C19HIF1A | |
| Hydrochloric Acid SCHEMBL27604363 | 0.79 | KCNN4 (0.64) | MAPTKMT2AKCNN4CYP2C19HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 168 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8039049-B2 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2011-10-18 | — | — | US | claimed |
| US-7405168-B2 | Plural treatment step process for treating dielectric films | TOKYO ELECTRON LIMITED (JP) | 2008-07-29 | — | — | US | claimed |
| US-20080076262-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2008-03-27 | — | — | US | claimed |
| US-7345000-B2 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2008-03-18 | — | — | US | claimed |
| US-20070087025-A1 | Reiteratively layered medical devices and method of preparing same | FITZHUGH ANTHONY | 2007-04-19 | — | — | US | claimed |
| WO-2007040834-A2 | PLURAL TREATMENT STEP PROCESS FOR TREATING DIELECTRIC FILMS | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| WO-2007040816-A2 | TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| WO-2007040856-A2 | PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| US-20070077782-A1 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | claimed |
| US-20070077353-A1 | Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | claimed |
| US-20070077781-A1 | Plural treatment step process for treating dielectric films | TOKYO ELECTRON LIMTED (JP) | 2007-04-05 | — | — | US | claimed |
| WO-2006091264-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2006-08-31 | — | — | WO | claimed |
| US-20050215072-A1 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2005-09-29 | — | — | US | claimed |
| EP-1436018-A1 | NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2004-07-14 | — | — | EP | claimed |
| EP-1432857-A1 | COATED OPTICAL FIBERS USING ADHESION PROMOTERS, AND METHODS FOR MAKING AND USING SAME | BORDEN CHEMICAL, INC. (US) | 2004-06-30 | — | — | EP | claimed |
| US-20030129397-A1 | Coated optical fibers using adhesion promoters, and methods for making and using same | HEXION INC. | 2003-07-10 | — | — | US | claimed |
| WO-2003026717-A1 | NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2003-04-03 | — | — | WO | claimed |
| WO-2003023101-A1 | COATED OPTICAL FIBERS USING ADHESION PROMOTERS, AND METHODS FOR MAKING AND USING SAME | BORDEN CHEMICAL, INC. (US) | 2003-03-20 | — | — | WO | claimed |
| US-4208312-A | ACYLOXYSILANE COMPONENT TO EXTEND POT LIFE | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 1980-06-17 | — | — | US | claimed |
| US-20260118764-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2026-04-30 | — | — | US | disclosed |
| EP-4715465-A1 | MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER | Nissan Chemical Corporation (JP) | 2026-03-25 | — | — | EP | disclosed |
| US-12585188-B2 | Composition for forming resist underlying film | NISSAN CHEMICAL CORPORATION (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4679175-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | Nissan Chemical Corporation (JP) | 2026-01-14 | — | — | EP | disclosed |
| US-20250377596-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250362609-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID | NISSAN CHEMICAL CORPORATION (JP) | 2025-11-27 | — | — | US | disclosed |
| US-20250355357-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2025-11-20 | — | — | US | disclosed |
| US-20250348001-A1 | METHOD FOR PRODUCING LAMINATE AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | NISSAN CHEMICAL CORPORATION (JP) | 2025-11-13 | — | — | US | disclosed |
| US-12339586-B2 | Photocurable resin composition containing self-crosslinkable polymer | NISSAN CHEMICAL CORPORATION (JP) | 2025-06-24 | — | — | US | disclosed |
| US-20250172869-A1 | WAFER END PROTECTIVE-FILM FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | NISSAN CHEMICAL CORPORATION (JP) | 2025-05-29 | — | — | US | disclosed |
| US-20250116936-A1 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKABLE POLYMER | NISSAN CHEMICAL CORPORATION (JP) | 2025-04-10 | — | — | US | disclosed |
| US-20250110402-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | NISSAN CHEMICAL CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| WO-2025041813-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ASSEMBLY | 日産化学株式会社 | 2025-02-27 | — | — | WO | disclosed |
| US-20250044692-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2025-02-06 | — | — | US | disclosed |
| EP-4492142-A1 | WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | Nissan Chemical Corporation (JP) | 2025-01-15 | — | — | EP | disclosed |
| US-20250011507-A1 | POLYCYCLIC AROMATIC HYDROCARBON PHOTOCURABLE RESIN COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2025-01-09 | — | — | US | disclosed |
| US-20250014901-A1 | WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | NISSAN CHEMICAL CORPORATION (JP) | 2025-01-09 | — | — | US | disclosed |
| EP-4485077-A1 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKING POLYMER | Nissan Chemical Corporation (JP) | 2025-01-01 | — | — | EP | disclosed |
| US-20240419073-A1 | ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2024-12-19 | — | — | US | disclosed |
| US-20240393693-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMINATE USING THE COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | NISSAN CHEMICAL CORPORATION (JP) | 2024-11-28 | — | — | US | disclosed |
| WO-2024237188-A1 | MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER | 日産化学株式会社 | 2024-11-21 | — | — | WO | disclosed |
| WO-2024225431-A1 | COMPOSITION FOR FORMING WET-REMOVABLE SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024195705-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM FOR i-RAY LITHOGRAPHY | 日産化学株式会社 | 2024-09-26 | — | — | WO | disclosed |
| EP-4435517-A1 | POLYCYCLIC AROMATIC HYDROCARBON-BASED PHOTO-CURABLE RESIN COMPOSITION | Nissan Chemical Corporation (JP) | 2024-09-25 | — | — | EP | disclosed |
| US-20240302744-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION | NISSAN CHEMICAL CORPORATION (JP) | 2024-09-12 | — | — | US | disclosed |
| WO-2024185665-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-09-12 | — | — | WO | disclosed |
| US-20240295819-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2024-09-05 | — | — | US | disclosed |
| US-20240295815-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2024-09-05 | — | — | US | disclosed |
| US-20240231230-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2024-07-11 | — | — | US | disclosed |
| EP-4398035-A1 | WAFER EDGE PROTECTIVE-FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | Nissan Chemical Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| US-20240201593-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| WO-2024063044-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-03-28 | — | — | WO | disclosed |
| US-20240069441-A1 | COMPOSITION FOR RESIST UNDERLYING FILM FORMATION | NISSAN CHEMICAL CORPORATION (JP) | 2024-02-29 | — | — | US | disclosed |
| WO-2024019064-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| WO-2024009993-A1 | METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023171733-A1 | WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2023162968-A1 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKING POLYMER | 日産化学株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023157943-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | 日産化学株式会社 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023136250-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-07-20 | — | — | WO | disclosed |
| US-20230168582-A1 | COMPOSITION FOR FORMING RESIST UNDERLYING FILM | NISSAN CHEMICAL CORPORATION (JP) | 2023-06-01 | — | — | US | disclosed |
| WO-2023085414-A1 | POLYCYCLIC AROMATIC HYDROCARBON-BASED PHOTO-CURABLE RESIN COMPOSITION | 日産化学株式会社 | 2023-05-19 | — | — | WO | disclosed |
| WO-2023074777-A1 | ADDITIVE-CONTAINING COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023037979-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, MULTILAYER BODY USING SAID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023033094-A1 | WAFER EDGE PROTECTIVE-FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023008507-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-02-02 | — | — | WO | disclosed |
| CN-115485624-A | Composition for forming resist underlayer film | 日产化学株式会社 | 2022-12-16 | — | — | CN | disclosed |
| WO-2022260154-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-12-15 | — | — | WO | disclosed |
| WO-2022230940-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-11-03 | — | — | WO | disclosed |
| WO-2022210960-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210944-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210901-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| EP-3039079-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DDP SPECIALTY ELECTRONIC MAT US 9 LLC (US) | 2022-05-18 | — | — | EP | disclosed |
| US-10766982-B2 | Cationic polymerization of olefins using green acids | LEWIS STEWART P (US) | 2020-09-08 | — | — | US | disclosed |
| US-20190330395-A1 | CATIONIC POLYMERIZATION OF OLEFINS USING GREEN ACIDS | LEWIS STEWART P (US) | 2019-10-31 | — | — | US | disclosed |
| EP-3141538-B1 | IMPROVED PROCESS STABILITY OF NBDE USING SUBSTITUTED PHENOL STABILIZERS | VERSUM MAT US LLC (US) | 2019-10-30 | — | — | EP | disclosed |
| EP-2318477-B1 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MAT USA INC (US) | 2019-06-05 | — | — | EP | disclosed |
| US-9909007-B2 | Curable silicone composition, cured product thereof, and optical semiconductor device | DOW CORNING CORPORATION (US) | 2018-03-06 | — | — | US | disclosed |
| EP-3141538-A1 | IMPROVED PROCESS STABILITY OF NBDE USING SUBSTITUTED PHENOL STABILIZERS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2017-03-15 | — | — | EP | disclosed |
| EP-2141141-B1 | Improved Process Stability of NBDE Using Substituted Phenol Stabilizers | AIR PROD & CHEM (US) | 2016-09-28 | — | — | EP | disclosed |
| EP-2914664-B1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO LTD (JP) | 2016-09-07 | — | — | EP | disclosed |
| US-20160215141-A1 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-07-28 | — | — | US | disclosed |
| EP-3039079-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Corporation (US) | 2016-07-06 | — | — | EP | disclosed |
| US-9312196-B2 | Curable silicone composition, cured product thereof, and optical semiconductor | DOW CORNING TORAY CO., LTD. (JP) | 2016-04-12 | — | — | US | disclosed |
| EP-1931613-B1 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS (US) | 2015-11-11 | — | — | EP | disclosed |
| US-20150252221-A1 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor | DOW TORAY CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150252220-A1 | Curable Silicone Composition, And Semiconductor Sealing Material And Optical Semiconductor Device Using The Same | DOW CORNING TORAY CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| EP-2914664-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2015-09-09 | — | — | EP | disclosed |
| EP-2898011-A1 | CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | Dow Corning Toray Co., Ltd. (JP) | 2015-07-29 | — | — | EP | disclosed |
| WO-2015030224-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING CORPORATION (US) | 2015-03-05 | — | — | WO | disclosed |
| EP-1790703-B1 | Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon | JGC CATALYSTS & CHEMICALS LTD (JP) | 2014-07-30 | — | — | EP | disclosed |
| US-20140191161-A1 | Curable Silicon Composition, Cured Product Thereof, And Optical Semiconductor Device | DOW CORNING TORAY CO., LTD. (JP) | 2014-07-10 | — | — | US | disclosed |
| US-20140187733-A1 | Organopolysiloxane, And Method For Producing Same | DOW CORNING TORAY CO., LTD. (JP) | 2014-07-03 | — | — | US | disclosed |
| EP-2733160-A1 | ORGANO POLYSILOXANE, AND METHOD FOR PRODUCING SAME | Dow Corning Toray Co., Ltd. (JP) | 2014-05-21 | — | — | EP | disclosed |
| EP-2730620-A1 | CURABLE SILICON COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2014-05-14 | — | — | EP | disclosed |
| WO-2014069610-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD. (JP) | 2014-05-08 | — | — | WO | disclosed |
| WO-2014046309-A1 | CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME | DOW CORNING TORAY CO., LTD. (JP) | 2014-03-27 | — | — | WO | disclosed |
| WO-2014002919-A1 | COATING AGENT, ELECTRICAL-ELECTRONIC EQUIPMENT, AND METHOD FOR PROTECTING METAL PARTS OF ELECTRICAL-ELECTRONIC EQUIPMENT | DOW CORNING TORAY CO., LTD. (JP) | 2014-01-03 | — | — | WO | disclosed |
| EP-1931746-B1 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS (US) | 2013-09-04 | — | — | EP | disclosed |
| US-8252704-B2 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2012-08-28 | — | — | US | disclosed |
| EP-0992556-B1 | COATING LIQUID FOR FORMING SILICA-BASED FILM HAVING LOW DIELECTRIC CONSTANT AND SUBSTRATE HAVING FILM OF LOW DIELECTRIC CONSTANT COATED THEREON | JGC CATALYSTS & CHEMICALS LTD (JP) | 2012-05-09 | — | — | EP | disclosed |
| US-8173213-B2 | Process stability of NBDE using substituted phenol stabilizers | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-05-08 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20110259242-A1 | Additives to Prevent Degradation of Cyclic Alkene Derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2011-10-27 | — | — | US | disclosed |
| US-8039049-B2 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2011-10-18 | — | — | US | disclosed |
| US-7985350-B2 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2011-07-26 | — | — | US | disclosed |
| EP-2318477-A1 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FujiFilm Electronic Materials USA, Inc. (US) | 2011-05-11 | — | — | EP | disclosed |
| US-7931823-B2 | stabilized cyclic alkene composition comprising cyclic alkenes and antioxidant compound to reduce or eliminate residue formation upon evaporation of such compositions; used to form dielectric films | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2011-04-26 | — | — | US | disclosed |
| US-20110091651-A1 | Additives to Prevent Degradation of Cyclic Alkene Derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2011-04-21 | — | — | US | disclosed |
| US-7901743-B2 | Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2011-03-08 | — | — | US | disclosed |
| US-7883639-B2 | stabilized cyclic alkene composition comprising cyclic alkenes and antioxidant compound to reduce or eliminate residue formation upon evaporation of such compositions; used to form dielectric films | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2011-02-08 | — | — | US | disclosed |
| US-7871536-B2 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2011-01-18 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| WO-2007033075-A9 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-04-29 | — | — | WO | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| WO-2010005937-A1 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-01-14 | — | — | WO | disclosed |
| EP-2141141-A1 | Improved Process Stability of NBDE Using Substituted Phenol Stabilizers | Air Products and Chemicals, Inc. (US) | 2010-01-06 | — | — | EP | disclosed |
| US-20090297711-A1 | Process Stability of NBDE Using Substituted Phenol Stabilizers | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-12-03 | — | — | US | disclosed |
| US-20090291210-A1 | Additives to Prevent Degradation of Cyclic Alkene Derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-11-26 | — | — | US | disclosed |
| US-20090061633-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-03-05 | — | — | US | disclosed |
| US-7485690-B2 | Sacrificial film-forming composition, patterning process, sacrificial film and removal method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| US-7405168-B2 | Plural treatment step process for treating dielectric films | TOKYO ELECTRON LIMITED (JP) | 2008-07-29 | — | — | US | disclosed |
| EP-1931613-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FujiFilm Electronic Materials USA, Inc. (US) | 2008-06-18 | — | — | EP | disclosed |
| EP-1931746-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FujiFilm Electronic Materials USA, Inc. (US) | 2008-06-18 | — | — | EP | disclosed |
| US-7385021-B2 | Sacrificial film-forming composition, patterning process, sacrificial film and removal method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| US-20080076262-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2008-03-27 | — | — | US | disclosed |
| US-7345000-B2 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2008-03-18 | — | — | US | disclosed |
| EP-1790703-A2 | Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon | CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) | 2007-05-30 | — | — | EP | disclosed |
| US-20070087025-A1 | Reiteratively layered medical devices and method of preparing same | FITZHUGH ANTHONY | 2007-04-19 | — | — | US | disclosed |
| WO-2007040834-A2 | PLURAL TREATMENT STEP PROCESS FOR TREATING DIELECTRIC FILMS | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | disclosed |
| WO-2007040816-A2 | TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | disclosed |
| WO-2007040856-A2 | PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | disclosed |
| US-20070077782-A1 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | disclosed |
| US-20070077353-A1 | Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | disclosed |
| US-20070077781-A1 | Plural treatment step process for treating dielectric films | TOKYO ELECTRON LIMTED (JP) | 2007-04-05 | — | — | US | disclosed |
| WO-2007033123-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-03-22 | — | — | WO | disclosed |
| WO-2007033075-A2 | ADDITIVES TO PREVENT DEGRADATION OF CYCLIC ALKENE DERIVATIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-03-22 | — | — | WO | disclosed |
| US-20070057235-A1 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-03-15 | — | — | US | disclosed |
| US-20070057234-A1 | Additives to prevent degradation of cyclic alkene derivatives | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-03-15 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20070014828-A1 | Cross-linked nitric oxide-releasing polyamine coated substrates, compositions comprising same and method of making same | GOVERNMENT OF THE USA, REPRESENTED BY THE SECRETARY, DEPT. OF HEALTH AND HUMAN SERVICES (US) | 2007-01-18 | — | — | US | disclosed |
| WO-2006091264-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2006-08-31 | — | — | WO | disclosed |
| EP-1342742-B1 | Room temperature curable polysiloxane compositions | HANSE CHEMIE AG (DE) | 2006-08-02 | — | — | EP | disclosed |
| EP-1165682-B1 | RESIN COMPOSITION AND CURED PRODUCT | DSM IP ASSETS BV (NL) | 2006-07-05 | — | — | EP | disclosed |
| EP-1545798-A4 | CROSS-LINKED NITRIC OXIDE-RELEASING POLYAMINE COATED SUBSTRATES, COMPOSITIONS COMPRISING SAME AND METHOD OF MAKING SAME | US GOV HEALTH & HUMAN SERV (US) | 2006-06-14 | — | — | EP | disclosed |
| US-7005398-B2 | Olefin polymerization catalyst, catalyst component for olefin polymerization, method of storing these, and process for producing olefin polymer | SUNALLOMER LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-20050274692-A1 | Sacrificial film-forming composition, patterning process, sacrificial film and removal method | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20050277755-A1 | Sacrificial film-forming composition, patterning process, sacrificial film and removal method | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20050215072-A1 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2005-09-29 | — | — | US | disclosed |
| EP-1545798-A1 | CROSS-LINKED NITRIC OXIDE-RELEASING POLYAMINE COATED SUBSTRATES, COMPOSITIONS COMPRISING SAME AND METHOD OF MAKING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2005-06-29 | — | — | EP | disclosed |
| EP-1436018-A1 | NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2004-07-14 | — | — | EP | disclosed |
| US-6727334-B2 | FOR FORMING COATINGS WITH HIGH HARDNESS, SCRATCH RESISTANCE, LOW CURLING PROPERTIES, ADHESION, AND TRANSPARENCY, AND FINE APPEARANCE ON THE SURFACE OF VARIOUS SUBSTRATES FOR SUCH AS PLASTICS | DSM N.V. (NL) | 2004-04-27 | — | — | US | disclosed |
| US-20040054102-A1 | Olefin polymerization catalyst, catalyst component for olefin polymerization, method of storing these, and process for producing olefin polymer | SUNALLOMER LTD. (JP) | 2004-03-18 | — | — | US | disclosed |
| WO-2004012874-A1 | CROSS-LINKED NITRIC OXIDE-RELEASING POLYAMINE COATED SUBSTRATES, COMPOSITIONS COMPRISING SAME AND METHOD OF MAKING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPT. OF HEALTH AND HUMAN SERVICES (US) | 2004-02-12 | — | — | WO | disclosed |
| EP-1359166-A1 | OLEFIN POLYMERIZATION CATALYST, CATALYST COMPONENT FOR OLEFIN POLYMERIZATION, METHOD OF STORING THESE, AND PROCESS FOR PRODUCING OLEFIN POLYMER | Sunallomer Ltd (JP) | 2003-11-05 | — | — | EP | disclosed |
| EP-1342742-A1 | Room temperature curable polysiloxane compositions | hanse chemie AG (DE) | 2003-09-10 | — | — | EP | disclosed |
| US-6562465-B1 | Coating liquid for forming a silica-containing film with a low-dielectric constant and substrate coated with such a film | CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) | 2003-05-13 | — | — | US | disclosed |
| WO-2003026717-A1 | NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2003-04-03 | — | — | WO | disclosed |
| US-20020058737-A1 | Resin composition and cured product | JSR CORPORATION (JP) | 2002-05-16 | — | — | US | disclosed |
| EP-1165682-A1 | RESIN COMPOSITION AND CURED PRODUCT | DSM N.V. (NL) | 2002-01-02 | — | — | EP | disclosed |
| US-6268440-B1 | MIXING WATER BASED COMPOSITE RESINS AND POLYSILOXANES WITH CONDENSATION REACTION, DISPERSION AND DISSOLVING | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2001-07-31 | — | — | US | disclosed |
| WO-2000047666-A1 | RESIN COMPOSITION AND CURED PRODUCT | DSM N.V. (NL) | 2000-08-17 | — | — | WO | disclosed |
| EP-0992556-A1 | COATING LIQUID FOR FORMING SILICA-BASED FILM HAVING LOW DIELECTRIC CONSTANT AND SUBSTRATE HAVING FILM OF LOW DIELECTRIC CONSTANT COATED THEREON | Catalysts & Chemicals Industries Co., Ltd. (JP) | 2000-04-12 | — | — | EP | disclosed |
| WO-1998045368-A1 | OLEFIN (CO-)POLYMER COMPOSITIONS AND METHOD OF PRODUCING THE SAME | CHISSO CORPORATION (JP) | 1998-10-15 | — | — | WO | disclosed |
| US-5563228-A | Method for the preparation of polyheterosiloxanes | DOW CORNING ASIA, LTD. (JP) | 1996-10-08 | — | — | US | disclosed |
| EP-0564004-B1 | A highly stereoregular polypropylene | CHISSO CORP (JP) | 1996-09-25 | — | — | EP | disclosed |
| EP-0669361-A2 | Method for the preparation of polyheterosiloxanes | DOW CORNING ASIA, Ltd. (JP) | 1995-08-30 | — | — | EP | disclosed |
| EP-0564004-A1 | A highly stereoregular polypropylene | CHISSO CORPORATION (JP) | 1993-10-06 | — | — | EP | disclosed |
| US-5077341-A | Using coordination catalyst | CHISSO CORPORATION (JP) | 1991-12-31 | — | — | US | disclosed |
| EP-0404519-A2 | A process for producing a high-stiffness polypropylene | CHISSO CORPORATION (JP) | 1990-12-27 | — | — | EP | disclosed |
| EP-0404519-A2 | A process for producing a high-stiffness polypropylene | CHISSO CORPORATION (JP) | 1990-12-27 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20070087025-A1 | Reiteratively layered medical devices and method of preparing same | NOS2, NOS1, NOS3 | MAPT 3023/4885KMT2A 738/4885KCNN4 861/4885 |
| US-20090297711-A1 | Process Stability of NBDE Using Substituted Phenol Stabilizers | CCNE2, CCNE1, C1R | MAPT 2173/4885KMT2A 3205/4885KCNN4 1976/4885 |
| US-20260118764-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM | SRSF1, MACF1, SRPK1 | MAPT 965/4885KMT2A 111/4885KCNN4 1472/4885 |
| US-12585188-B2 | Composition for forming resist underlying film | SRR, SMC1A, ASH2L | MAPT 4790/4885KMT2A 1145/4885KCNN4 893/4885 |
| US-20110259242-A1 | Additives to Prevent Degradation of Cyclic Alkene Derivatives | GPX4, GPX1, NFE2L2 | MAPT 4051/4885KMT2A 3634/4885KCNN4 4380/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.