Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2A | P28223 | 6/20 | 0.39 |
| ▸ | HRH1 | P35367 | 6/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | TAAR1 | Q96RJ0 | 3/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.36 |
| ▸ | MMP8 | P22894 | 1/20 | 0.35 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL708012 | 0.84 | HTR2A (0.36) | HTR2AHRH1LMNATAAR1TDP1 | |
| SCHEMBL705098 | 0.81 | LTA4H (0.42) | HTR2ALMNAPOLBTDP1SIGMAR1 | |
| SCHEMBL705237 | 0.80 | HRH1 (0.42) | HTR2AHRH1LMNATAAR1POLB | |
| SCHEMBL705544 | 0.78 | HTR2A (0.41) | HTR2AHRH1LMNATAAR1TDP1 | |
| SCHEMBL704363 | 0.75 | TAAR1 (0.39) | HTR2AHRH1LMNATAAR1TDP1 | |
| SCHEMBL27157805 | 0.74 | HTR2A (0.41) | HTR2AHRH1TAAR1TDP1TSHR | |
| SCHEMBL706548 | 0.73 | HRH1 (0.39) | HTR2AHRH1LMNATAAR1TDP1 | |
| SCHEMBL242576 | 0.72 | LMNA (0.40) | HTR2AHRH1LMNATAAR1POLB | |
| SCHEMBL702495 | 0.72 | SCN4A (0.39) | HTR2AHRH1TAAR1TDP1TSHR | |
| SCHEMBL18662231 | 0.72 | HTR2A (0.39) | HTR2AHRH1LMNATAAR1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108586254-B | Process for producing diaryl carbonate and process for producing aromatic polycarbonate | 旭化成株式会社 | 2021-06-18 | — | — | CN | disclosed |
| CN-108395374-B | Process for producing diaryl carbonate | 旭化成株式会社 | 2021-03-30 | — | — | CN | disclosed |
| US-9546237-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2017-01-17 | — | — | US | disclosed |
| US-9029482-B2 | Method for preparing polycondensation resin | CHEIL INDUSTRIES INC. (KR) | 2015-05-12 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20130331520-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORPORATION (JP) | 2013-12-12 | — | — | US | disclosed |
| CN-103249762-A | Addition-curable metallosiloxane compound | DAICEL CORP | 2013-08-14 | — | — | CN | disclosed |
| US-20130165621-A1 | Method for Preparing Polycondensation Resin | CHEIL INDUSTRIES INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| CN-100535054-C | Silica film forming material, silica film and preparation method thereof | FUJITSU LTD (JP) | 2009-09-02 | — | — | CN | disclosed |
| US-20070122631-A1 | Flexible substrate and coating liquid | SUMITOMO CORPORATION (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| CN-1891757-A | Silica film forming material, silica film and method of manufacturing the same | FUJITSU LTD (JP) | 2007-01-10 | — | — | CN | disclosed |
| CN-1878735-A | Flexible substrate and coating liquid | SUMITOMO CORP (JP) | 2006-12-13 | — | — | CN | disclosed |
| EP-1690839-A1 | FLEXIBLE SUBSTRATE AND COATING LIQUID | Sumitomo Corporation (JP) | 2006-08-16 | — | — | EP | disclosed |