SCHEMBL715338

SCHEMBL715338

CCCO[SiH](c1ccccc1)C(C)C

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
HPGD P15428 1/20 0.33
LTA4H P09960 2/20 0.32
ALDH1A1 P00352 1/20 0.32
SIGMAR1 Q99720 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707194 0.89 LTA4H (0.42) LTA4HALDH1A1
SCHEMBL705403 0.84 L3MBTL1 (0.32) LMNAMEN1KMT2ALTA4HSIGMAR1
SCHEMBL313696 0.75 LMNA (0.44) LMNAMEN1KMT2AHPGDLTA4H
SCHEMBL3481818 0.75 LMNA (0.39) LMNAMEN1KMT2AHPGDLTA4H
SCHEMBL15914634 0.74 TDP1 (0.32) LMNAHPGDALDH1A1SIGMAR1
SCHEMBL23091446 0.74 TAAR1 (0.30)
SCHEMBL705167 0.74 LMNA (0.38) LMNAMEN1KMT2AHPGDLTA4H
SCHEMBL19927035 0.73
SCHEMBL711280 0.73 CA4 (0.35) LMNAKMT2AHPGDLTA4HALDH1A1
SCHEMBL707357 0.72 LMNA (0.37) LMNAMEN1KMT2AHPGDLTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed