SCHEMBL7645708

SCHEMBL7645708

Cc1cc2ccccc2c2[nH]nnc12

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 4/20 0.40
CYP1A2 P05177 4/20 0.40
CCR1 P32246 1/20 0.39
CCR8 P51685 1/20 0.39
OPRM1 P35372 1/20 0.38
OPRD1 P41143 1/20 0.38
UHRF1 Q96T88 1/20 0.38
ALDH1A1 P00352 5/20 0.36
KDM4E B2RXH2 3/20 0.36
HPGD P15428 3/20 0.36
HSD17B10 Q99714 2/20 0.36
GAA P10253 1/20 0.36
HTT P42858 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HCRTR1 O43613 1/20 0.34
HCRTR2 O43614 1/20 0.34
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
KMT2A Q03164 2/20 0.33
L3MBTL1 Q9Y468 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11538652 0.84 DHFR (0.38) CYP2A6CYP1A2CCR1CCR8OPRM1
SCHEMBL11438193 0.79 ALDH1A1 (0.41) CYP2A6CYP1A2CCR1CCR8ALDH1A1
SCHEMBL29068872 0.79 HPRT1 (0.34) ALDH1A1HPGDHSD17B10TDP1KMT2A
SCHEMBL10725453 0.79 KDM4E (0.38) ALDH1A1KDM4EHPGDHSD17B10GAA
SCHEMBL31017312 0.77 MAP4K4 (0.41) ALDH1A1KDM4EHPGDKMT2AMAPT
SCHEMBL10888299 0.74 RCE1 (0.38) CYP1A2ALDH1A1HPGDHSD17B10KMT2A
SCHEMBL7749986 0.73 PIM1 (0.49) CYP1A2ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL11103322 0.73 MPO (0.40) KMT2AMEN1
SCHEMBL1263565 0.73 MAPT (0.42) CYP1A2ALDH1A1KDM4EHPGDGAA
SCHEMBL31017311 0.73 L3MBTL1 (0.35) ALDH1A1KMT2AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-55161368-A None JP disclosed
US-6476487-B2 Solder circuit SHOWA DENKO K.K. (JP) 2002-11-05 US disclosed
US-20010020744-A1 Solder circuit SHOWA DENKO K.K. (JP) 2001-09-13 US disclosed
US-5928440-A Method of forming solder film SHOWA DENKO K.K. (JP) 1999-07-27 US disclosed
US-5750271-A Method of forming solder film SHOWA DENKO K.K. (JP) 1998-05-12 US disclosed
EP-0595343-B1 Method of forming solder film SHOWA DENKO KK (JP) 1998-02-18 EP disclosed
US-5713997-A Solution for selectively imparting tackiness to a metallic surface SHOWA DENKO K.K. (JP) 1998-02-03 US disclosed
US-5556023-A Method of forming solder film SHOWA DENKO K.K. (JP) 1996-09-17 US disclosed
EP-0595343-A2 Method of forming solder film SHOWA DENKO KABUSHIKI KAISHA (JP) 1994-05-04 EP disclosed
JP-S55161368-A ALKALINE CELL HITACHI MAXELL LTD 1980-12-15 JP disclosed