SCHEMBL8405147

SCHEMBL8405147

CCCc1ccc(N)cc1OC(=O)c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.43
LMNA P02545 3/20 0.43
MAPT P10636 3/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
NPSR1 Q6W5P4 2/20 0.42
SLC6A3 Q01959 1/20 0.42
CYP3A4 P08684 3/20 0.40
MEN1 O00255 3/20 0.40
ESR1 P03372 2/20 0.40
ESR2 Q92731 2/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
CYP1A2 P05177 2/20 0.40
MAOA P21397 1/20 0.40
CYP2C9 P11712 1/20 0.39
TSHR P16473 1/20 0.39
CYP2C19 P33261 1/20 0.39
PDE4D Q08499 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8405141 0.83 NPSR1 (0.53) KMT2ALMNAMAPTSMN1; SMN2NPSR1
SCHEMBL3760693 0.82 NPSR1 (0.58) KMT2ALMNAMAPTSMN1; SMN2NPSR1
SCHEMBL8405085 0.79 ALOX5 (0.48) KMT2ALMNAMAPTMEN1TDP1
SCHEMBL28320252 0.77 MAPT (0.51) KMT2ALMNAMAPTSMN1; SMN2NPSR1
SCHEMBL2507209 0.77 LMNA (0.51) KMT2ALMNAMAPTSMN1; SMN2SLC6A3
SCHEMBL4631646 0.77 NPSR1 (0.53) KMT2ALMNAMAPTSMN1; SMN2NPSR1
SCHEMBL10923583 0.77 NPSR1 (0.49) KMT2ALMNAMAPTSMN1; SMN2NPSR1
SCHEMBL13915600 0.77 HPGD (0.55) KMT2ALMNAMAPTSMN1; SMN2SLC6A3
SCHEMBL27788091 0.75 LMNA (0.45) KMT2ALMNAMAPTNPSR1CYP3A4
SCHEMBL2508910 0.75 LMNA (0.49) KMT2ALMNAMAPTSMN1; SMN2SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0567993-B1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI CHEMICAL IND (JP) 1999-07-14 EP disclosed
US-5397419-A Dissolving in solvent, coating or impregnation to form prepreg, heating, pressurization; heat resistant paints, electronics KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0567993-A1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-11-03 EP disclosed