SCHEMBL8528509

SCHEMBL8528509

OC(O)C(=Cc1ccccc1)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C1 Q04828 1/20 0.47
PRMT1 Q99873 1/20 0.42
ESR1 P03372 1/20 0.42
CYP19A1 P11511 2/20 0.41
CYP11B2 P19099 2/20 0.41
ALDH1A1 P00352 3/20 0.40
LMNA P02545 2/20 0.40
MAPT P10636 2/20 0.40
MEN1 O00255 2/20 0.40
HPGD P15428 2/20 0.40
KMT2A Q03164 2/20 0.40
KDM4E B2RXH2 1/20 0.40
POLB P06746 1/20 0.40
MAPK1 P28482 1/20 0.40
HTT P42858 1/20 0.40
TSHR P16473 2/20 0.39
AKR1C3 P42330 1/20 0.39
PLIN1 O60240 1/20 0.38
BCHE P06276 1/20 0.38
TNFRSF1A P19438 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6227960 0.81 LMNA (0.48) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL4632474 0.81 LMNA (0.48) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL10711205 0.80 AKR1C1 (0.45) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL5960470 0.80 AKR1C1 (0.45) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL2835097 0.80 AKR1C1 (0.45) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL146717 0.80 AKR1C1 (0.45) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL4375040 0.78 L3MBTL1 (0.47) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL11356886 0.78 AKR1C1 (0.40) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL16500484 0.74 MEN1 (0.42) AKR1C1PRMT1ESR1CYP19A1CYP11B2
SCHEMBL297682 0.72 AKR1C1 (0.39) AKR1C1PRMT1ESR1ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106715535-A Silane functionalized compounds and compositions thereof 瀚森公司 2017-05-24 CN claimed
CN-104797549-A Process for stripping a liquid medium SOLVAY 2015-07-22 CN claimed
CN-101061577-A Flip chip system and preparation method thereof INTEL CORP (US) 2007-10-24 CN claimed
CN-1437625-A Epoxy resin and preparation method thereof DOW GLOBE TECHNOLOGIES INC (US) 2003-08-20 CN claimed
CN-1299385-A Process for preparing hydroxy-functionalized polyesters DOW CHEMICAL CO (US) 2001-06-13 CN claimed
CN-1269812-A Process for preparing hydroxy-functionalized polyesters DOW CHEMICAL CO (US) 2000-10-11 CN claimed
US-5840376-A A BULK MOLDINGS COMPRISING A CURED THERMOSET POLYEPOXIDES WITH ENHANCING TENSILE MODULUS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-11-24 US claimed
WO-1998046696-A1 HIGH MAGNETIC FIELD PROCESSING OF LIQUID CRYSTALLINE POLYMERS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-10-22 WO claimed
CN-103140532-B Epoxy resin adduct and thermosets thereof Blue Cube Intellectual Property Co.,Ltd. (US) 2016-05-04 CN disclosed
CN-103228694-B Heat curable composition and the thermosetting material prepared by heat curable composition Blue Cube Intellectual Property Co.,Ltd. (US) 2016-04-27 CN disclosed
CN-105255312-A EPOXY RESIN HARDENER COMPOSITIONS AND EPOXY RESIN COMPOSITIONS CONTAINING SUCH HARDENER COMPOSITIONS DOW CHEMICAL CO 2016-01-20 CN disclosed
CN-105153068-A Product containing epichlorohydrin, its preparation and its use in various applications SOLVAY 2015-12-16 CN disclosed
CN-102686489-B Case, its preparation method of coating DOW GLOBAL TECHNOLOGIES LLC (US) 2015-11-25 CN disclosed
CN-102648247-B Coating composition DOW GLOBAL TECHNOLOGIES LLC (US) 2015-10-14 CN disclosed
CN-1437625-A Epoxy resin and preparation method thereof DOW GLOBE TECHNOLOGIES INC (US) 2003-08-20 CN disclosed
CN-1299385-A Process for preparing hydroxy-functionalized polyesters DOW CHEMICAL CO (US) 2001-06-13 CN disclosed
CN-1269812-A Process for preparing hydroxy-functionalized polyesters DOW CHEMICAL CO (US) 2000-10-11 CN disclosed
US-5840376-A A BULK MOLDINGS COMPRISING A CURED THERMOSET POLYEPOXIDES WITH ENHANCING TENSILE MODULUS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-11-24 US disclosed
WO-1998046696-A1 HIGH MAGNETIC FIELD PROCESSING OF LIQUID CRYSTALLINE POLYMERS THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1998-10-22 WO disclosed
US-5811504-A CURABLE WITH CROSSLINKING AGENTS CORNELL RESEARCH FOUNDATION, INC. (US) 1998-09-22 US disclosed