Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 9/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 2/20 | 0.33 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | CA3 | P07451 | 2/20 | 0.33 |
| ▸ | CA4 | P22748 | 2/20 | 0.33 |
| ▸ | CA6 | P23280 | 2/20 | 0.33 |
| ▸ | CA5A | P35218 | 2/20 | 0.33 |
| ▸ | CA7 | P43166 | 2/20 | 0.33 |
| ▸ | CA9 | Q16790 | 2/20 | 0.33 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.33 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
| ▸ | CPB2 | Q96IY4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15201755 | 0.83 | TSHR (0.36) | TSHRMEN1KMT2AFDPS | |
| SCHEMBL15305224 | 0.82 | CYP2D6 (0.30) | — | |
| SCHEMBL23521037 | 0.81 | NFKB1 (0.30) | — | |
| Ammonia Solution, Strong SCHEMBL28650831 | 0.81 | TSHR (0.35) | TSHRMEN1KMT2AFDPS | |
| SCHEMBL10141486 | 0.80 | TSHR (0.32) | TSHRMEN1KMT2AFDPS | |
| SCHEMBL16448809 | 0.80 | HRH3 (0.32) | — | |
| SCHEMBL11947283 | 0.75 | DNM1 (0.46) | DNM1TSHRMEN1KMT2AALDH1A1 | |
| SCHEMBL24444340 | 0.75 | DNM1 (0.46) | DNM1TSHRMEN1KMT2AALDH1A1 | |
| SCHEMBL32686197 | 0.74 | DNM1 (0.47) | DNM1TSHRMEN1KMT2AALDH1A1 | |
| SCHEMBL5859130 | 0.74 | NFKB1 (0.47) | DNM1TSHRMEN1KMT2AALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113426400-B | Water rectification filler with surface micro-nano structure and preparation method thereof | 中国工程物理研究院核物理与化学研究所 | 2022-07-05 | — | — | CN | claimed |
| CN-111197182-B | Etching solution with silicon oxide corrosion inhibitor and method of using the same | 弗萨姆材料美国有限责任公司 | 2022-06-03 | — | — | CN | claimed |
| CN-113426400-A | Water rectification filler with surface micro-nano structure and preparation method thereof | 中国工程物理研究院核物理与化学研究所 | 2021-09-24 | — | — | CN | claimed |
| US-20160122696-A1 | COMPOSITIONS AND METHODS FOR REMOVING CERIA PARTICLES FROM A SURFACE | ADVANCED TECHNOLOGY MATERIALS, INC. | 2016-05-05 | — | — | US | claimed |
| US-20160075971-A1 | COPPER CLEANING AND PROTECTION FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2016-03-17 | — | — | US | claimed |
| US-12637616-B2 | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device | VERSUM MATERIALS US, LLC (US) | 2026-05-26 | — | — | US | disclosed |
| US-20260109898-A1 | USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON | BASF SE (DE) | 2026-04-23 | — | — | US | disclosed |
| US-20260071149-A1 | MICROELECTRONIC DEVICE CLEANING COMPOSITION | ENTEGRIS INC (US) | 2026-03-12 | — | — | US | disclosed |
| US-12559704-B2 | Microelectronic device cleaning composition | ENTEGRIS, INC. (US) | 2026-02-24 | — | — | US | disclosed |
| US-12525464-B2 | Use of a composition and a process for selectively etching silicon | BASF SE (DE) | 2026-01-13 | — | — | US | disclosed |
| US-12486473-B2 | Post CMP cleaning composition | ENTEGRIS, INC. (US) | 2025-12-02 | — | — | US | disclosed |
| EP-4634964-A1 | SOLUTION FOR POST ETCH RESIDUE REMOVAL (PERR) | BASF SE (DE) | 2025-10-22 | — | — | EP | disclosed |
| US-20180346811-A1 | Etching Solution For Selectively Removing Silicon Nitride During Manufacture Of A Semiconductor Device | Versum Marerials US, LLC (US) | 2018-12-06 | — | — | US | disclosed |
| US-20160122696-A1 | COMPOSITIONS AND METHODS FOR REMOVING CERIA PARTICLES FROM A SURFACE | ADVANCED TECHNOLOGY MATERIALS, INC. | 2016-05-05 | — | — | US | disclosed |
| US-20160075971-A1 | COPPER CLEANING AND PROTECTION FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2016-03-17 | — | — | US | disclosed |
| US-20160020087-A1 | POST-CMP REMOVAL USING COMPOSITIONS AND METHOD OF USE | ENTEGRIS, INC. (US) | 2016-01-21 | — | — | US | disclosed |
| US-9234162-B2 | Cleaning composition and methods of use thereof | LMC ENTERPRISES (US) | 2016-01-12 | — | — | US | disclosed |
| US-20140209127-A1 | CLEANING COMPOSITION AND METHODS OF USE THEREOF | LMC ENTERPRISES (US) | 2014-07-31 | — | — | US | disclosed |
| US-5747430-A | POLYETHER AND POLYSILOXANE BLEND FOR LUBRICANTS | EXXON RESEARCH AND ENGINEERING COMPANY (US) | 1998-05-05 | — | — | US | disclosed |
| WO-1996003480-A1 | LUBRICANT COMPOSITION | EXXON RESEARCH AND ENGINEERING COMPANY (US) | 1996-02-08 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12637616-B2 | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device | KCNH3, F7, KCNH2 | DNM1 2667/4885TSHR 320/4885MEN1 1749/4885 |
| US-20260109898-A1 | USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON | PIEZO1, ASIC1, CHRM1 | DNM1 2348/4885TSHR 3971/4885MEN1 909/4885 |
| US-12559704-B2 | Microelectronic device cleaning composition | HCN1, KCNH3, ADH1C | DNM1 3811/4885TSHR 3591/4885MEN1 792/4885 |
| US-20260071149-A1 | MICROELECTRONIC DEVICE CLEANING COMPOSITION | PHOSPHO1, TET2, CHKB | DNM1 3459/4885TSHR 2398/4885MEN1 1585/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.