Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19433048 | 0.94 | — | — | |
| SCHEMBL869225 | 0.90 | THRB (0.36) | — | |
| SCHEMBL868388 | 0.90 | ALDH1A1 (0.38) | MAPK1HIF1A | |
| SCHEMBL870443 | 0.90 | ALDH1A1 (0.42) | MAPK1HIF1A | |
| SCHEMBL869494 | 0.85 | ALDH1A1 (0.35) | MAPK1HIF1A | |
| SCHEMBL869221 | 0.81 | DGKA (0.37) | — | |
| SCHEMBL31096884 | 0.81 | MAPK1 (0.34) | MAPK1HIF1A | |
| SCHEMBL1756074 | 0.77 | NAAA (0.43) | — | |
| SCHEMBL19433047 | 0.76 | ALDH1A1 (0.35) | HIF1A | |
| SCHEMBL8374682 | 0.75 | ALDH1A1 (0.38) | HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| CN-114829432-B | Radical polymerizable resin composition and cured product thereof | 株式会社力森诺科 | 2024-09-17 | — | — | CN | disclosed |
| CN-114269848-B | Composition for forming heat conductive material, heat conductive sheet, and device with heat conductive layer | 富士胶片株式会社 | 2024-07-16 | — | — | CN | disclosed |
| WO-2024142769-A1 | RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCTS OF THESE | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| CN-118255944-A | Resin composition, composite material, and cured product thereof | 株式会社力森诺科 | 2024-06-28 | — | — | CN | disclosed |
| CN-114846032-B | Radical polymerizable resin composition and cured product thereof | 株式会社力森诺科 | 2024-06-18 | — | — | CN | disclosed |
| CN-117136175-A | Recess filling material kit, cured product thereof, and recess filling method | 株式会社力森诺科 | 2023-11-28 | — | — | CN | disclosed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |