SCHEMBL8764478

SCHEMBL8764478

Cc1[nH]c(-c2ccccc2)nc1Cc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PIN1 Q13526 1/20 0.50
DRD2 P14416 1/20 0.49
DRD4 P21917 1/20 0.49
DRD3 P35462 1/20 0.49
NPY5R Q15761 1/20 0.46
HPGDS O60760 1/20 0.46
LTB4R Q15722 1/20 0.45
MAPT P10636 2/20 0.44
GAA P10253 4/20 0.44
NR1H2 P55055 1/20 0.44
NR1H3 Q13133 1/20 0.44
POLB P06746 3/20 0.42
KDM4E B2RXH2 2/20 0.42
ALDH1A1 P00352 2/20 0.42
HTT P42858 2/20 0.42
HSD17B10 Q99714 2/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
NPC1 O15118 2/20 0.41
RAB9A P51151 2/20 0.41
HPGD P15428 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8973605 0.92 PIN1 (0.46) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL8973149 0.89 MAPK13 (0.47) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL8973635 0.89 DRD2 (0.47) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL8973651 0.82 ALDH1A1 (0.43) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL28412520 0.82 PIN1 (0.53) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL10727938 0.82 LTB4R (0.61) PIN1LTB4RMAPTGAANR1H2
SCHEMBL8973612 0.82 PIN1 (0.46) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL1099825 0.81 PIN1 (0.56) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL1436137 0.81 PIN1 (0.51) PIN1DRD2DRD4DRD3NPY5R
SCHEMBL8972962 0.80 SMN1; SMN2 (0.45) PIN1DRD2DRD4DRD3NPY5R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0627499-B1 Agent for treating surfaces of copper and copper alloys SHIKOKU CHEM (JP) 1997-07-23 EP claimed
US-5560785-A TREATING SURFACE WITH SOLUTION OF IMIDAZOLE COMPOUND, COPPER COMPOUND, ZINC COMPOUND, STABILIZERS SHIKOKU CHEMICALS CORPORATION (JP) 1996-10-01 US claimed
US-5498301-A ON A PRINTED WIRING BOARD, HEAT RESISTANT, MOISTURE RESISTANT, A 2-ARYLIMIDAZOLE, CARBOXYLIC ACID, AMMONIA, WATER SHIKOKU CHEMICALS CORPORATION (JP) 1996-03-12 US claimed
JP-6346252-A None JP disclosed
EP-0627499-B1 Agent for treating surfaces of copper and copper alloys SHIKOKU CHEM (JP) 1997-07-23 EP disclosed
US-5560785-A TREATING SURFACE WITH SOLUTION OF IMIDAZOLE COMPOUND, COPPER COMPOUND, ZINC COMPOUND, STABILIZERS SHIKOKU CHEMICALS CORPORATION (JP) 1996-10-01 US disclosed
US-5560785-A TREATING SURFACE WITH SOLUTION OF IMIDAZOLE COMPOUND, COPPER COMPOUND, ZINC COMPOUND, STABILIZERS SHIKOKU CHEMICALS CORPORATION (JP) 1996-10-01 US disclosed
US-5498301-A ON A PRINTED WIRING BOARD, HEAT RESISTANT, MOISTURE RESISTANT, A 2-ARYLIMIDAZOLE, CARBOXYLIC ACID, AMMONIA, WATER SHIKOKU CHEMICALS CORPORATION (JP) 1996-03-12 US disclosed
JP-H06346252-A SURFACE TREATING AGENT FOR COPPER AND COPPER ALLOY SHIKOKU CHEM CORP 1994-12-20 JP disclosed
EP-0627499-A1 Agent for treating surfaces of copper and copper alloys SHIKOKU CHEMICALS CORPORATION (JP) 1994-12-07 EP disclosed