SCHEMBL899192

SCHEMBL899192

Cc1cc(Cc2cc(C)c(O)c(N)c2C)c(C)c(N)c1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.45
HIF1A Q16665 3/20 0.45
HSD17B10 Q99714 2/20 0.45
CYP1A2 P05177 1/20 0.45
ALOX15 P16050 1/20 0.45
CASP7 P55210 1/20 0.45
GAA P10253 3/20 0.40
MAPT P10636 3/20 0.40
KDM4E B2RXH2 2/20 0.40
LMNA P02545 2/20 0.40
SHBG P04278 1/20 0.39
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
PKM P14618 1/20 0.35
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
AMY1A P0DUB6 1/20 0.34
HSPA5 P11021 1/20 0.34
CYP2C9 P11712 2/20 0.33
CYP2C19 P33261 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29662311 1.00 ALDH1A1 (0.45) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL14549270 0.94 ALDH1A1 (0.41) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL2784200 0.87 ALDH1A1 (0.40) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL31146724 0.79 SHBG (0.43) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL1176032 0.79 SHBG (0.43) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL30485796 0.79 SHBG (0.43) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL12339808 0.79 DHFR (0.38) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL12339819 0.78 ALDH1A1 (0.41) ALDH1A1HIF1AHSD17B10CYP1A2ALOX15
SCHEMBL11085769 0.77 ALDH1A1 (0.46) ALDH1A1CYP1A2GAAMAPTKDM4E
SCHEMBL12339809 0.76 DHFR (0.38) ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120305484-A1 Thermally Rearranged (TR) Polymers as Membranes for Ethanol Dehydration BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2012-12-06 US claimed
EP-4692940-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD Sumitomo Bakelite Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20220171285-A1 METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2022-06-02 US disclosed
WO-2020054644-A1 PERMANENT FILM-FORMING PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, CURED FILM PRODUCTION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 住友ベークライト株式会社 2020-03-19 WO disclosed
WO-2019003913-A1 PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 住友ベークライト株式会社 2019-01-03 WO disclosed
WO-2019003918-A1 PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 住友ベークライト株式会社 2019-01-03 WO disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
EP-2196850-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-06-16 EP disclosed
US-20100076156-A1 PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT SUMITOMO BAKELITE CO., LTD. (JP) 2010-03-25 US disclosed
US-20100062273-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD (JP) 2010-03-11 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
EP-2113810-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME, AND DISPLAY DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-04 EP disclosed
EP-2083326-A1 PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, PROTECTIVE FILM, AND ELECTRONIC EQUIPMENT Sumitomo Bakelite Company, Ltd. (JP) 2009-07-29 EP disclosed
EP-2077291-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT Sumitomo Bakelite Company, Ltd. (JP) 2009-07-08 EP disclosed
EP-2077291-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT Sumitomo Bakelite Company, Ltd. (JP) 2009-07-08 EP disclosed
US-20090068584-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH SUMITOMO BAKELITE CO., LTD. (JP) 2009-03-12 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT RARA, AASDHPPT, GABRP ALDH1A1 3721/4885HIF1A 1625/4885HSD17B10 4338/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.