SCHEMBL9307175

SCHEMBL9307175

C=Cc1ccc(O)c(Cc2ccccc2)c1

nearest known ligand 0.57

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.57
CYP3A4 P08684 1/20 0.57
HPGD P15428 1/20 0.57
ALOX15 P16050 1/20 0.57
KMT2A Q03164 1/20 0.57
HIF1A Q16665 1/20 0.57
HSD17B10 Q99714 1/20 0.57
BCL2 P10415 1/20 0.53
BCL2L1 Q07817 1/20 0.53
ALOX5 P09917 1/20 0.47
SLC7A5 Q01650 1/20 0.47
IDH1 O75874 1/20 0.46
TRPA1 O75762 1/20 0.42
KEAP1 Q14145 1/20 0.42
HNF4A P41235 1/20 0.40
EGFR P00533 1/20 0.40
PAX8 Q06710 1/20 0.40
ALDH1A1 P00352 1/20 0.39
TSHR P16473 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28629080 0.91 TRPA1 (0.46) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL13899836 0.85 TRPA1 (0.50) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL5855849 0.84 HSPA5 (0.57) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL27508658 0.79 TSHR (0.40) MEN1CYP3A4KMT2ABCL2BCL2L1
SCHEMBL14283807 0.79 KEAP1 (0.46) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL10688359 0.78 XDH (0.58) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL4657571 0.78 BCL2 (0.39) BCL2BCL2L1ALOX5EGFRALDH1A1
SCHEMBL6029429 0.77 MEN1 (0.62) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL2045956 0.76 BCL2 (0.39) MEN1CYP3A4HPGDALOX15KMT2A
SCHEMBL10886054 0.76 IDH1 (0.70) MEN1CYP3A4HPGDALOX15KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108255018-B Photoresist composition comprising poly (p-hydroxystyrene) epoxy resin as film-forming resin 湖北固润科技股份有限公司 2020-12-11 CN disclosed
US-5376498-A Blend of an alkali-soluble resin, compound that generates an acid upon irradiation, functional aromatic compound and a phenolic compound JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-12-27 US disclosed
EP-0542572-A1 Negative type radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-05-19 EP disclosed