SCHEMBL959019

SCHEMBL959019

Cc1ccccc1C(O)C(=O)c1ccccc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 4/20 0.57
CES1 P23141 4/20 0.57
LMNA P02545 1/20 0.57
HSP90AA1 P07900 1/20 0.45
ATM Q13315 1/20 0.45
ALDH1A1 P00352 2/20 0.45
KDM4E B2RXH2 1/20 0.45
L3MBTL1 Q9Y468 2/20 0.44
TDP1 Q9NUW8 1/20 0.44
ACP3 P15309 1/20 0.43
POLB P06746 1/20 0.42
HPGD P15428 1/20 0.42
ESR1 P03372 1/20 0.41
ALKBH5 Q6P6C2 1/20 0.41
PGR P06401 1/20 0.41
ADRA2A P08913 1/20 0.41
ADRA2B P18089 1/20 0.41
HTR2A P28223 1/20 0.41
HRH1 P35367 1/20 0.41
KCNH2 Q12809 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28256435 0.85 ALDH1A1 (0.50) CES2CES1LMNAALDH1A1KDM4E
SCHEMBL10405150 0.84 LMNA (0.45) CES2CES1LMNAALDH1A1KDM4E
SCHEMBL9055063 0.82 CES2 (0.50) CES2CES1LMNAALDH1A1KDM4E
SCHEMBL8150583 0.82 CES2 (0.50) CES2CES1LMNAALDH1A1KDM4E
SCHEMBL168463 0.82 LMNA (0.52) CES2CES1LMNAALDH1A1L3MBTL1
SCHEMBL168464 0.82 LMNA (0.52) CES2CES1LMNAALDH1A1L3MBTL1
SCHEMBL538051 0.82 LMNA (0.52) CES2CES1LMNAALDH1A1L3MBTL1
SCHEMBL6518870 0.81 PGR (0.49) CES2CES1LMNAHSP90AA1ATM
SCHEMBL29579913 0.81 PGR (0.49) CES2CES1LMNAHSP90AA1ATM
SCHEMBL29616382 0.81 CES2 (0.53) CES2CES1ACP3HPGDESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 205 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5886136-A Pattern forming process NIPPON ZEON CO., LTD. (JP) 1999-03-23 US claimed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component HD MICROSYSTEMS, LTD. (JP) 2026-04-14 US disclosed
US-20250341777-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT RESONAC CORP (JP) 2025-11-06 US disclosed
US-20250271757-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2025-08-28 US disclosed
WO-2025099883-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-15 WO disclosed
WO-2025095080-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND CURED PRODUCT 株式会社レゾナック 2025-05-08 WO disclosed
WO-2025088705-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-01 WO disclosed
WO-2025088815-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED PRODUCT, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-01 WO disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed
US-4912122-A Triazolyl alkanones or triazolyl-alkanols BAYER AKTIENGESELLSCHAFT (DE) 1990-03-27 US disclosed
US-4908283-A Curing acryloyl-denatured polyalkylene oxide and inorganic ion salt by irradiating with active rays UBE INDUSTRIES, LTD. (JP) 1990-03-13 US disclosed
US-4776877-A FUNGICIDES BAYER AKTIENGESELLSCHAFT (DE) 1988-10-11 US disclosed
US-4772623-A FUNGICIDES, MICROBIOCIDES, PLANT GROWTH REGULATORS BAYER AKTIENGESELLSCHAFT (DE) 1988-09-20 US disclosed
EP-0257863-A1 Plastic cladding composition for silica or glass core optical fiber, and silica or glass core optical fiber prepared therefrom MITSUBISHI RAYON CO., LTD. (JP) 1988-03-02 EP disclosed
EP-0256765-A1 Plastic cladding composition for plastic core optical fiber, and plastic core optical fiber prepared therefrom MITSUBISHI RAYON CO., LTD. (JP) 1988-02-24 EP disclosed
US-4582843-A FUNGICIDES, MICROBIOCIDES BAYER AKTIENGESELLSCHAFT (DE) 1986-04-15 US disclosed
US-4337348-A SENSITIZERS FOR PHOTOCURING POLYSILOXANES SHIN-ETSU CHEMICAL COMPANY LIMITED (JP) 1982-06-29 US disclosed
US-3968309-A Molded articles of plastics having improved surface characteristics and process for producing the same DAINIPPON PRINTING CO., LTD. (JA) 1976-07-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component ARCN1, P4HA1, COL1A1 CES2 309/4885CES1 854/4885LMNA 1465/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.