Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES1 | P23141 | 7/20 | 0.42 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.34 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.34 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 3/20 | 0.33 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.33 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.32 |
| ▸ | FABP7 | O15540 | 1/20 | 0.32 |
| ▸ | CES2 | O00748 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | CPA1 | P15085 | 1/20 | 0.32 |
| ▸ | SRC | P12931 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL761110 | 0.87 | CES2 (0.44) | CES1CES2ACHE | |
| SCHEMBL10492099 | 0.86 | HDAC1 (0.44) | HDAC1HDAC2HDAC6 | |
| SCHEMBL10584041 | 0.83 | LTA4H (0.42) | — | |
| SCHEMBL10492032 | 0.82 | CES1 (0.36) | CES1HDAC6 | |
| SCHEMBL7584607 | 0.81 | LTA4H (0.45) | HDAC1HDAC2HDAC6 | |
| SCHEMBL10907991 | 0.81 | CA2 (0.38) | CES1HDAC1CES2ACHE | |
| SCHEMBL108192 | 0.80 | CYP1A2 (0.38) | CES1KCNN4CES2SRC | |
| SCHEMBL104018 | 0.80 | ELANE (0.39) | KCNN4HDAC1HDAC2HDAC6SRC | |
| SCHEMBL10601724 | 0.79 | THRB (0.41) | CES1HDAC1HDAC2HDAC6 | |
| SCHEMBL1002371 | 0.78 | TRPV1 (0.38) | HDAC1ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 409 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026097702-A1 | PHOTOSENSITIVE COMPOSITION, METHOD FOR PREPARING PATTERN, CURED PRODUCT, AND ELECTRONIC COMPONENT | 江苏艾森半导体材料股份有限公司 | 2026-05-15 | — | — | WO | disclosed |
| US-20260118767-A1 | REVERSE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-30 | — | — | US | disclosed |
| US-20260044081-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-12 | — | — | US | disclosed |
| EP-4692941-A2 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4621486-A2 | POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-24 | — | — | EP | disclosed |
| US-20250289931-A1 | POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-18 | — | — | US | disclosed |
| EP-4592299-A1 | SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-07-30 | — | — | EP | disclosed |
| US-20250237953-A1 | SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250231492-A1 | MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE | SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) | 2025-07-17 | — | — | US | disclosed |
| US-20250231491-A1 | PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST | SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) | 2025-07-17 | — | — | US | disclosed |
| US-5498765-A | Positive photoresist composition containing photoacid generator and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-03-12 | — | — | US | disclosed |
| US-5432039-A | Radiation sensitive quinone diazide and resin composition for microlens | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1995-07-11 | — | — | US | disclosed |
| US-5374500-A | Positive photoresist composition containing photoacid generator and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1994-12-20 | — | — | US | disclosed |
| EP-0619522-A2 | Positive photoresist composition containing photoacid generator and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1994-10-12 | — | — | EP | disclosed |
| EP-0594452-A2 | Radiation sensitive resin composition for microlens | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1994-04-27 | — | — | EP | disclosed |
| US-5266444-A | Positives photoimages with crosslinking and onium curing agent | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1993-11-30 | — | — | US | disclosed |
| EP-0530095-A1 | Improved sensitization of photopolymerizable compositions | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1993-03-03 | — | — | EP | disclosed |
| US-5055439-A | PHOTOACID GENERATING COMPOSITION AND SENSITIZER THEREFOR | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-10-08 | — | — | US | disclosed |
| EP-0435531-A2 | Photoacid generating composition and sensitizer therefor | International Business Machines Corporation (US) | 1991-07-03 | — | — | EP | disclosed |
| US-4250053-A | WITH FLUORESCENT COMPOUND | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1981-02-10 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250289931-A1 | POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | ASH2L, PUF60, IDUA | CES1 4246/4885KCNN4 263/4885HDAC1 1279/4885 |
| US-20260118767-A1 | REVERSE PATTERNING PROCESS | EFNA1, EPHA4, ETV6 | CES1 2618/4885KCNN4 449/4885HDAC1 4383/4885 |
| US-20260044081-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS | SMC1A, SPOUT1, LBR | CES1 3024/4885KCNN4 2435/4885HDAC1 497/4885 |
| US-20250237953-A1 | SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS | SMURF1, OSR1, SIK1 | CES1 3505/4885KCNN4 2122/4885HDAC1 1298/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.