Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | BRD4 | O60885 | 1/20 | 0.41 |
| ▸ | CREBBP | Q92793 | 1/20 | 0.41 |
| ▸ | PPARG | P37231 | 5/20 | 0.40 |
| ▸ | PPARA | Q07869 | 5/20 | 0.40 |
| ▸ | SCN9A | Q15858 | 1/20 | 0.40 |
| ▸ | ACACB | O00763 | 2/20 | 0.39 |
| ▸ | ACACA | Q13085 | 2/20 | 0.39 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.38 |
| ▸ | SCN4A | P35499 | 2/20 | 0.38 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.38 |
| ▸ | THPO | P40225 | 1/20 | 0.38 |
| ▸ | BTK | Q06187 | 1/20 | 0.37 |
| ▸ | RXRA | P19793 | 1/20 | 0.36 |
| ▸ | RXRB | P28702 | 1/20 | 0.36 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3718003 | 0.78 | SCN4A (0.44) | SCN9ASCN4ACYP1A2CYP3A4CYP2D6 | |
| SCHEMBL104735 | 0.77 | SCN4A (0.48) | SCN9ASCN4ACYP1A2CYP3A4CYP2D6 | |
| SCHEMBL9418424 | 0.76 | ALDH1A1 (0.51) | KMT2APPARGPPARACYP1A2RXRA | |
| SCHEMBL26050649 | 0.76 | TRPV3 (0.41) | — | |
| SCHEMBL13376487 | 0.74 | ADRA2A (0.51) | KMT2APPARGPPARARXRARXRB | |
| SCHEMBL1337526 | 0.73 | ACACB (0.60) | KMT2APPARGPPARAACACBACACA | |
| SCHEMBL13271315 | 0.72 | PPARG (0.68) | KMT2ABRD4CREBBPPPARGPPARA | |
| SCHEMBL197284 | 0.72 | ALDH1A3 (0.56) | KMT2AACACBACACAALDH1A3MAP4K4 | |
| SCHEMBL20522393 | 0.71 | ALDH1A1 (0.52) | KMT2ABRD4CREBBPPPARGPPARA | |
| SCHEMBL28698396 | 0.71 | KMT2A (0.47) | KMT2ABRD4CREBBPPPARGPPARA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230272156-A1 | CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | DIC CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| US-8703845-B2 | Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material | DIC CORPORATION (JP) | 2014-04-22 | — | — | US | disclosed |
| US-20130237639-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL | DIC CORPORATION (JP) | 2013-09-12 | — | — | US | disclosed |
| EP-2623535-A1 | CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL | DIC Corporation (JP) | 2013-08-07 | — | — | EP | disclosed |
| US-8263714-B2 | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20110275739-A1 | EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-11-10 | — | — | US | disclosed |
| US-7985822-B2 | Epoxy resin cured with phenol-formaldehyde resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2011-07-26 | — | — | US | disclosed |
| EP-1785441-B1 | EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN | DAINIPPON INK & CHEMICALS (JP) | 2011-06-08 | — | — | EP | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1785441-A1 | EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2007-05-16 | — | — | EP | disclosed |