SCHEMBL16990198

SCHEMBL16990198

O=C1CCC(=O)N1OS(=O)(=O)c1c(Cl)cc(Cl)cc1Cl

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PARL Q9H300 2/20 0.50
▸ CA1 P00915 1/20 0.34
▸ CA2 P00918 1/20 0.34
▸ CA9 Q16790 1/20 0.34
▸ CNR1 P21554 1/20 0.34
▸ HPGD P15428 4/20 0.33
▸ ALDH1A1 P00352 4/20 0.33
▸ KDM4E B2RXH2 3/20 0.33
▸ KMT2A Q03164 3/20 0.33
▸ MAPT P10636 3/20 0.33
▸ CYP1A2 P05177 1/20 0.33
▸ CYP3A4 P08684 1/20 0.33
▸ XBP1 P17861 1/20 0.33
▸ CYP2C19 P33261 1/20 0.33
▸ NPSR1 Q6W5P4 1/20 0.33
▸ SMN1; SMN2 Q16637 2/20 0.32
▸ MMP2 P08253 2/20 0.32
▸ ACLY P53396 2/20 0.32
▸ SPR P35270 1/20 0.31
▸ LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2965577 0.76 PARL (0.50) PARLCA1CA2CA9CNR1
SCHEMBL1607770 0.75 PARL (0.68) PARLCA1CA2CA9HPGD
SCHEMBL65774 0.72 PARL (0.50) PARLCA1CA2HPGDALDH1A1
SCHEMBL16990204 0.72 PARL (0.50) PARLCA1CA2CA9HPGD
SCHEMBL12339094 0.71 PARL (0.81) PARLCA1CA2CA9HPGD
SCHEMBL503521 0.71 PARL (0.52) PARLCA1CA2HPGDALDH1A1
SCHEMBL22251627 0.69 PARL (0.76) PARLCA1CA2HPGDALDH1A1
SCHEMBL16990197 0.69 CNR1 (0.37) CA1CA2CA9CNR1ALDH1A1
SCHEMBL5405474 0.69 PARL (0.46) PARLCA1CA2CA9HPGD
SCHEMBL2958503 0.68 FABP4 (0.47) PARLHPGDALDH1A1KDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106795384-B Dispersed carbon-coated metal particles, articles and uses 柯达公司 2020-10-30 — — CN disclosed
US-9851823-B2 Electronic devices and precursor articles EASTMAN KODAK COMPANY (US) 2017-12-26 — — US disclosed
US-20170147101-A1 ELECTRONIC DEVICES AND PRECURSOR ARTICLES BANK OF AMERICA, N.A., AS AGENT 2017-05-25 — — US disclosed
US-9650533-B2 Articles containing carbon-coated metal particles EASTMAN KODAK COMPANY (US) 2017-05-16 — — US disclosed
US-9637659-B2 Latex primer composition and latex primed substrates EASTMAN KODAK COMPANY (US) 2017-05-02 — — US disclosed
US-9606652-B2 Electronic devices and precursor articles EASTMAN KODAK COMPANY (US) 2017-03-28 — — US disclosed
US-9505942-B2 Preparation of patterned or electrically-conductive articles EASTMAN KODAK COMPANY (US) 2016-11-29 — — US disclosed
US-9447501-B2 Forming articles and devices with carbon-coated metal particles EASTMAN KODAK COMPANY (US) 2016-09-20 — — US disclosed
US-9434852-B2 Photocurable compositions with dispersed carbon-coated metal particles EASTMAN KODAK COMPANY (US) 2016-09-06 — — US disclosed
US-9359517-B2 Non-aqueous compositions of dispersed carbon-coated metal particles EASTMAN KODAK COMPANY (US) 2016-06-07 — — US disclosed
US-20150370284-A1 ELECTRONIC DEVICES AND PRECURSOR ARTICLES BANK OF AMERICA, N.A., AS AGENT 2015-12-24 — — US disclosed
US-20150367594-A1 PATTERNED AND PRIMED TRANSPARENT ARTICLES BANK OF AMERICA, N.A., AS AGENT 2015-12-24 — — US disclosed
US-20150368805-A1 PREPARATION OF PATTERNED OR ELECTRICALLY-CONDUCTIVE ARTICLES BANK OF AMERICA, N.A., AS AGENT 2015-12-24 — — US disclosed
US-20150368501-A1 LATEX PRIMER COMPOSITION AND LATEX PRIMED SUBSTRATES BANK OF AMERICA, N.A., AS AGENT 2015-12-24 — — US disclosed
US-9207533-B2 Photopolymerizable compositions for electroless plating methods EASTMAN KODAK COMPANY (US) 2015-12-08 — — US disclosed
US-9205628-B1 Patterned and primed transparent articles EASTMAN KODAK COMPANY (US) 2015-12-08 — — US disclosed
US-9188861-B2 Photopolymerizable compositions for electroless plating methods EASTMAN KODAK COMPANY (US) 2015-11-17 — — US disclosed
WO-2015134084-A1 PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS EASTMAN KODAK COMPANY (US) 2015-09-11 — — WO disclosed
US-20150253661-A1 PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS BANK OF AMERICA, N.A., AS AGENT 2015-09-10 — — US disclosed
US-20150227041-A1 PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS BANK OF AMERICA, N.A., AS AGENT 2015-08-13 — — US disclosed
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