SCHEMBL18122999

SCHEMBL18122999

CCCC1(CCC)c2cc(C(=O)/C(=N/OC(C)=O)c3ccccc3C)ccc2-c2ccc(C(=O)c3cccc4ccccc34)cc21

nearest known ligand 0.41

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ CNR2 P34972 17/20 0.41
▸ CDC25B P30305 1/20 0.36
▸ NPC1 O15118 1/20 0.34
▸ RAB9A P51151 1/20 0.34
▸ CNR1 P21554 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18122992 0.92 ALDH1A1 (0.34) NPC1RAB9A
SCHEMBL24970943 0.92 CNR2 (0.33) CNR2CNR1
SCHEMBL18123004 0.91 CNR2 (0.41) CNR2CDC25BNPC1RAB9ACNR1
SCHEMBL25911827 0.89 PDK2 (0.35) CNR2NPC1RAB9A
SCHEMBL18122993 0.89 CNR2 (0.36) CNR2CDC25BNPC1RAB9ACNR1
SCHEMBL18123006 0.88 PDK2 (0.33) NPC1RAB9A
SCHEMBL26443682 0.88 PDK2 (0.33) NPC1RAB9A
SCHEMBL17056199 0.87 CNR2 (0.39) CNR2CDC25BCNR1
SCHEMBL18123002 0.84 PDK2 (0.41) NPC1RAB9A
SCHEMBL18123034 0.84 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
WO-2023127402-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023127401-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023120077-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023074266-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
WO-2023074265-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 — — US disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
WO-2017007010-A1 SILICON-CONTAINING RESIN COMPOSITION 東京応化工業株式会社 2017-01-12 — — WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM RARA, LCP1, CUTA CNR2 1552/4885CDC25B 4705/4885NPC1 2823/4885
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 CNR2 4716/4885CDC25B 3188/4885NPC1 2457/4885
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND C1R, CRY1, C1S CNR2 1361/4885CDC25B 865/4885NPC1 1861/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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