SCHEMBL18123000

SCHEMBL18123000

CCCC1(CCC)c2ccccc2-c2ccc(C(=O)/C(=N/OC(C)=O)c3ccccc3)cc21

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
▸ APEX1 P27695 1/20 0.39
▸ PDK2 Q15119 17/20 0.36
▸ HTR7 P34969 2/20 0.32
▸ HTR2B P41595 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18926235 0.92 PDK2 (0.38) APEX1PDK2
SCHEMBL18122997 0.89 APEX1 (0.35) APEX1PDK2
SCHEMBL18122995 0.88 APEX1 (0.38) APEX1PDK2HTR7HTR2B
SCHEMBL26443682 0.88 PDK2 (0.33) APEX1PDK2HTR7HTR2B
SCHEMBL18123006 0.88 PDK2 (0.33) APEX1PDK2HTR7HTR2B
SCHEMBL18123031 0.88 PDK2 (0.40) APEX1PDK2
SCHEMBL21431274 0.86 HCAR3 (0.32) APEX1PDK2
SCHEMBL18123003 0.86 L3MBTL1 (0.33) APEX1PDK2HTR7HTR2B
SCHEMBL18812921 0.85 APEX1 (0.43) APEX1PDK2
SCHEMBL18812920 0.85 APEX1 (0.43) APEX1PDK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 — — US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 — — US disclosed
WO-2023127402-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023127401-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023120077-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023074265-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
WO-2023074264-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
WO-2023074266-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2018-04-19 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2018-03-29 — — US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 — — EP disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-08 — — US disclosed
WO-2017007010-A1 SILICON-CONTAINING RESIN COMPOSITION 東京応化工業株式会社 2017-01-12 — — WO disclosed
WO-2016158679-A1 ENERGY-SENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2016-10-06 — — WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180107114-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM RARA, LCP1, CUTA APEX1 2902/4885PDK2 4505/4885HTR7 2209/4885
US-20180086717-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT SLC9A2, SLC9A1, NHERF1 APEX1 365/4885PDK2 2563/4885HTR7 323/4885
US-20170160636-A1 PHOTOSENSITIVE COMPOSITION AND COMPOUND C1R, CRY1, C1S APEX1 871/4885PDK2 2998/4885HTR7 2461/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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