SCHEMBL18280623

SCHEMBL18280623

CC(C)(C)OC(=O)C[C@H](Nc1ccc(-n2cccc2)cc1)C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LTA4H P09960 2/20 0.40
▸ ALDH1A1 P00352 1/20 0.40
▸ MEN1 O00255 2/20 0.38
▸ KMT2A Q03164 2/20 0.38
▸ NSD2 O96028 1/20 0.38
▸ POLB P06746 1/20 0.38
▸ GRK2 P25098 1/20 0.38
▸ CASP6 P55212 1/20 0.38
▸ CTDSP1 Q9GZU7 1/20 0.38
▸ AOC2 O75106 3/20 0.37
▸ GPR119 Q8TDV5 1/20 0.37
▸ KDM4E B2RXH2 1/20 0.36
▸ GAA P10253 1/20 0.36
▸ MAPT P10636 1/20 0.36
▸ MAPK1 P28482 1/20 0.36
▸ RAB9A P51151 1/20 0.36
▸ NPSR1 Q6W5P4 1/20 0.36
▸ L3MBTL1 Q9Y468 1/20 0.35
▸ PKM P14618 1/20 0.35
▸ HPGD P15428 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL38122 0.84 PPARA (0.42) ALDH1A1KDM4EGAAMAPTMAPK1
SCHEMBL38121 0.84 PPARA (0.42) ALDH1A1KDM4EGAAMAPTMAPK1
SCHEMBL28312030 0.77 RAB9A (0.45) ALDH1A1MEN1KMT2APOLBKDM4E
SCHEMBL4085456 0.74 NAMPT (0.46) KDM4ERAB9APKM
SCHEMBL27257857 0.74 KLK5 (0.45) ALDH1A1KMT2A
SCHEMBL13123351 0.72 RAB9A (0.47) ALDH1A1POLBKDM4EGAAMAPT
SCHEMBL29126042 0.71 CTSK (0.41) ALDH1A1MEN1KMT2AGAAMAPT
SCHEMBL13108597 0.71 KDM4E (0.41) ALDH1A1KDM4EGAAMAPTMAPK1
SCHEMBL28611674 0.70 LMNA (0.41) ALDH1A1MEN1KMT2APOLBKDM4E
SCHEMBL20238613 0.70 LTA4H (0.60) LTA4HALDH1A1MEN1KMT2ANSD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240142876-A1 SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION JSR CORPORATION (JP) 2024-05-02 — — US disclosed
US-20240105451-A1 SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION JSR CORPORATION (JP) 2024-03-28 — — US disclosed
WO-2023199881-A1 METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND RESIST UNDERLAYER FILM FORMING COMPOSITION JSR株式会社 2023-10-19 — — WO disclosed
CN-111562720-B Photo-sensitized chemically amplified resist material, pattern forming method, semiconductor device, mask for lithography, and template for nanoimprint 东京毅力科创株式会社 2023-09-29 — — CN disclosed
WO-2022259885-A1 SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM JSR株式会社 2022-12-15 — — WO disclosed
EP-3109703-B1 PHOTOSENSITIZATION CHEMICAL-AMPLIFICATION TYPE RESIST MATERIAL, AND METHOD FOR FORMING PATTERN USING SAME TOKYO ELECTRON LTD (JP) 2020-12-30 — — EP disclosed
CN-111562720-A Photosensitizing chemically amplified resist material, method for forming pattern, semiconductor device, mask for lithography, and template for nanoimprint 东京毅力科创株式会社 2020-08-21 — — CN disclosed
US-10073348-B2 Resist-pattern-forming method and chemically amplified resist material OSAKA UNIVERSITY (JP) 2018-09-11 — — US disclosed
US-10073349-B2 Chemically amplified resist material, pattern-forming method, compound, and production method of compound OSAKA UNIVERSITY (JP) 2018-09-11 — — US disclosed
US-10025187-B2 Photosensitization chemical-amplification type resist material, method for forming pattern using same, semiconductor device, mask for lithography, and template for nanoimprinting TOKYO ELECTRON LIMITED (JP) 2018-07-17 — — US disclosed
US-10018911-B2 Chemically amplified resist material and resist pattern-forming method JSR CORPORATION (JP) 2018-07-10 — — US disclosed
US-9989849-B2 Chemically amplified resist material and resist pattern-forming method JSR CORPORATION (JP) 2018-06-05 — — US disclosed
US-9971247-B2 Pattern-forming method OSAKA UNIVERSITY (JP) 2018-05-15 — — US disclosed
US-20170131634-A1 CHEMICALLY AMPLIFIED RESIST MATERIAL AND RESIST PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-05-11 — — US disclosed
US-20170131633-A1 CHEMICALLY AMPLIFIED RESIST MATERIAL AND RESIST PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-05-11 — — US disclosed
US-20170052449-A1 CHEMICALLY AMPLIFIED RESIST MATERIAL, PATTERN-FORMING METHOD, COMPOUND, AND PRODUCTION METHOD OF COMPOUND OSAKA UNIVERSITY (JP) 2017-02-23 — — US disclosed
US-20170052450-A1 PATTERN-FORMING METHOD OSAKA UNIVERSITY (JP) 2017-02-23 — — US disclosed
US-20170052448-A1 RESIST-PATTERN-FORMING METHOD AND CHEMICALLY AMPLIFIED RESIST MATERIAL OSAKA UNIVERSITY (JP) 2017-02-23 — — US disclosed
EP-3109703-A1 PHOTOSENSITIZATION CHEMICAL-AMPLIFICATION TYPE RESIST MATERIAL, METHOD FOR FORMING PATTERN USING SAME, SEMICONDUCTOR DEVICE, MASK FOR LITHOGRAPHY, AND TEMPLATE FOR NANOIMPRINTING Tokyo Electron Limited (JP) 2016-12-28 — — EP disclosed
US-20160357103-A1 PHOTOSENSITIZATION CHEMICAL-AMPLIFICATION TYPE RESIST MATERIAL, METHOD FOR FORMING PATTERN USING SAME, SEMICONDUCTOR DEVICE, MASK FOR LITHOGRAPHY, AND TEMPLATE FOR NANOIMPRINTING TOKYO ELECTRON LIMITED (JP) 2016-12-08 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10073348-B2 Resist-pattern-forming method and chemically amplified resist material XRCC6, XRCC5, BLM LTA4H 3364/4885ALDH1A1 3374/4885MEN1 627/4885
US-10025187-B2 Photosensitization chemical-amplification type resist material, method for forming pattern using same, semiconductor device, mask for lithography, and template for nanoimprinting ASIC1, ASIC3, CLTA LTA4H 711/4885ALDH1A1 1963/4885MEN1 847/4885
US-10073349-B2 Chemically amplified resist material, pattern-forming method, compound, and production method of compound RER1, POLR1A, FEM1B LTA4H 2083/4885ALDH1A1 1044/4885MEN1 742/4885
US-10018911-B2 Chemically amplified resist material and resist pattern-forming method SLC11A2, XRCC5, RAD54L LTA4H 3691/4885ALDH1A1 2183/4885MEN1 455/4885
US-20170052449-A1 CHEMICALLY AMPLIFIED RESIST MATERIAL, PATTERN-FORMING METHOD, COMPOUND, AND PRODUCTION METHOD OF COMPOUND RER1, POLR1A, FEM1B LTA4H 2083/4885ALDH1A1 1044/4885MEN1 742/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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