SCHEMBL1837592

SCHEMBL1837592

C=C(C)C(=O)Oc1c(Br)cc(Br)cc1C(C)(C)c1cc(Br)cc(Br)c1OC(=O)C(=C)C

nearest known ligand 0.37

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.37
ALDH1A1 P00352 1/20 0.33
ELANE P08246 1/20 0.32
ALOX15 P16050 1/20 0.30
ALOX12 P18054 1/20 0.30
LMNA P02545 1/20 0.30
MAPT P10636 1/20 0.30
PTGDR2 Q9Y5Y4 1/20 0.30
KMT2A Q03164 1/20 0.30
ATM Q13315 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7620486 0.91 HSD17B10 (0.37) HSD17B10ALDH1A1ELANEALOX15ALOX12
SCHEMBL297222 0.85 HSD17B10 (0.44) HSD17B10ALDH1A1ELANEALOX15ALOX12
SCHEMBL674146 0.80 ALDH1A1 (0.44) HSD17B10ALDH1A1ELANEALOX15ALOX12
SCHEMBL13813635 0.80 HSD17B10 (0.40) HSD17B10ALDH1A1ELANEALOX15ALOX12
SCHEMBL7897872 0.79 ALDH1A1 (0.34) HSD17B10ALDH1A1MAPTPTGDR2
SCHEMBL2452962 0.78 THRB (0.40) HSD17B10ALDH1A1LMNAKMT2A
SCHEMBL5609003 0.77 PTGDR2 (0.46) ALDH1A1ELANEALOX15LMNAPTGDR2
SCHEMBL7618929 0.76 GABRA1 (0.41) HSD17B10ALDH1A1ELANE
SCHEMBL11173038 0.75 THRA (0.33)
SCHEMBL10409152 0.75 HIF1A (0.56) HSD17B10ALDH1A1ELANEALOX15ALOX12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6352782-B1 None US claimed
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP claimed
EP-1834975-A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin General Electric Company (US) 2007-09-19 EP claimed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US claimed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US claimed
US-6352782-B1 None US disclosed
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP disclosed
EP-2316870-A1 Poly(phenylene ether) - polyvinyl thermosetting resin SABIC Innovative Plastics IP B.V. (NL) 2011-05-04 EP disclosed
EP-1834975-A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin General Electric Company (US) 2007-09-19 EP disclosed
EP-1265946-B1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GEN ELECTRIC (US) 2007-03-28 EP disclosed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
EP-1265946-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2002-12-18 EP disclosed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US disclosed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US disclosed
US-20010053450-A1 POLY (PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2001-12-20 US disclosed
WO-2001040354-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2001-06-07 WO disclosed