SCHEMBL1840501

SCHEMBL1840501

C=C(C)C(=O)NCCC(=C)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TGFBR1 P36897 1/20 0.37
PLA2G2A P14555 2/20 0.34
ALOX15 P16050 1/20 0.33
HSD17B10 Q99714 1/20 0.33
TET2 Q6N021 4/20 0.32
ALDH1A1 P00352 3/20 0.32
KDM4E B2RXH2 1/20 0.32
ADRA1A P35348 1/20 0.31
PLAAT5 Q96KN8 1/20 0.31
PLAAT4 Q9UL19 1/20 0.31
TET3 O43151 1/20 0.30
TET1 Q8NFU7 1/20 0.30
NPC1 O15118 1/20 0.30
RAB9A P51151 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
PLA2G4A P47712 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1880850 0.88 PLA2G4A (0.39) TGFBR1PLA2G2AALOX15HSD17B10TET2
SCHEMBL4939278 0.83 ADRA1A (0.47) ALOX15HSD17B10TET2ALDH1A1KDM4E
SCHEMBL907324 0.83 PLA2G2A (0.48) TGFBR1PLA2G2AALDH1A1KDM4EADRA1A
SCHEMBL15535068 0.80 ALDH1A1 (0.41) TGFBR1PLA2G2AALDH1A1KDM4EADRA1A
SCHEMBL316224 0.79 TGFBR1 (0.41) TGFBR1HSD17B10ALDH1A1KDM4ENPC1
SCHEMBL13205118 0.78 PLA2G2A (0.36) TGFBR1PLA2G2AALDH1A1KDM4EPLAAT5
SCHEMBL4596397 0.78 ECE1 (0.39) ALOX15HSD17B10TET2ALDH1A1KDM4E
Methacrylic Acid SCHEMBL2176821 0.77 ALOX15 (0.34) TGFBR1ALOX15HSD17B10TET2ALDH1A1
Methacrylic Acid SCHEMBL16770046 0.77 TGFBR1 (0.42) TGFBR1ALDH1A1KDM4ENPC1RAB9A
SCHEMBL6402194 0.77 TDP1 (0.40) TGFBR1PLA2G2AALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6352782-B1 None US claimed
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP claimed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US claimed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US claimed
US-6352782-B1 None US disclosed
EP-1834975-B1 Thermosetting poly(phenylene ether) SABIC INNOVATIVE PLASTICS IP (NL) 2011-05-11 EP disclosed
EP-2316870-A1 Poly(phenylene ether) - polyvinyl thermosetting resin SABIC Innovative Plastics IP B.V. (NL) 2011-05-04 EP disclosed
EP-1834975-A1 Poly(Phenylene ether) - Polyvinyl thermosetting resin General Electric Company (US) 2007-09-19 EP disclosed
EP-1265946-B1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GEN ELECTRIC (US) 2007-03-28 EP disclosed
US-6617398-B2 Forming laminate; curing; cladding with copper; printed circuits GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
EP-1265946-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2002-12-18 EP disclosed
US-20020028337-A1 Poly (phenylene ether) - polyvinyl thermosetting resin SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-03-07 US disclosed
US-6352782-B2 REACTING A POLYPHENYLENE ETHER CONTAINING HYDROXY GROUPS THAT HAVE BEEN CAPPED WITH A COMPOUND CONTAINING ETHYLENICALLY UNSATURATION WITH A CURABLE UNSATURATED MONOMER CAPABLE OF REACTING WITH ETHYLENICALLY UNSATURATED COMPOUND GENERAL ELECTRIC COMPANY 2002-03-05 US disclosed
US-20010053450-A1 POLY (PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2001-12-20 US disclosed
WO-2001040354-A1 POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN GENERAL ELECTRIC COMPANY (US) 2001-06-07 WO disclosed