SCHEMBL213386

SCHEMBL213386

O=S(=O)([O-])C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F.c1ccc([I+]c2ccccc2)cc1

nearest known ligand 0.40

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA2 P00918 18/20 0.40
CA1 P00915 17/20 0.39
MMP1 P03956 3/20 0.38
MMP2 P08253 3/20 0.38
MMP9 P14780 3/20 0.38
MMP8 P22894 3/20 0.38
MMP13 P45452 3/20 0.38
GPR3 P46089 1/20 0.34
PTPN1 P18031 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL59303 1.00 CA2 (0.40) CA2CA1MMP1MMP2MMP9
SCHEMBL51422 0.98 CA2 (0.38) CA2CA1MMP1MMP2MMP9
Trifluoromethanesulfonic Acid SCHEMBL12613417 0.95 GPR3 (0.40) CA2CA1MMP1MMP2MMP9
SCHEMBL3284031 0.93 CA2 (0.35) CA2CA1MMP1MMP2MMP9
SCHEMBL1805421 0.91 CA2 (0.34) CA2CA1MMP1MMP2MMP9
SCHEMBL7702939 0.90 GPR3 (0.35) CA2CA1MMP1MMP2MMP9
SCHEMBL5372804 0.89 HSD11B1 (0.37) CA2CA1MMP1MMP2MMP9
SCHEMBL2901040 0.88 MMP2 (0.43) CA2CA1MMP1MMP2MMP9
SCHEMBL1800746 0.88 ALDH1A1 (0.37) MMP1MMP9MMP13
SCHEMBL7708260 0.87 HSD11B1 (0.38) CA2CA1MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1291 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121873631-B Spin-on carbon composition, semiconductor preparation method and semiconductor device Jiageng Innovation Laboratory (CN) 2026-05-26 CN claimed
CN-122011922-A Bottom anti-reflection coating composition and preparation and application thereof 嘉庚创新实验室 2026-05-12 CN claimed
CN-119463004-B 3, 4-Dihydroxystyrene polymer, preparation thereof and photoresist composition 微芯新材料(湖州)有限公司 2025-06-10 CN claimed
CN-120005123-A Acrylic ester block copolymer resin, photoresist, and preparation method and application thereof 中国石油化工股份有限公司 2025-05-16 CN claimed
CN-119923600-A Chemically amplified positive resist composition for improving pattern profile and enhancing adhesion YC化学制品株式会社 2025-05-02 CN claimed
CN-119463004-A 3, 4-Dihydroxystyrene polymer, preparation thereof and photoresist composition 微芯新材料(湖州)有限公司 2025-02-18 CN claimed
CN-119463075-A Poly (4-hydroxystyrene) -based block copolymer and preparation and application thereof 微芯新材料(湖州)有限公司 2025-02-18 CN claimed
US-20250021002-A1 BOTTOM ANTI-REFLECTIVE COATING FOR DEEP ULTRAVIOLET LITHOGRAPHY, PREPARATION METHOD THEREFOR AND USE THEREOF CHINA ADVANCED LITHOGRAPHIC MATERIAL TECHNOLOGY CO. LTD. (CN) 2025-01-16 US claimed
CN-115368494-B Monomer copolymer containing hexafluoroisopropanol, preparation method thereof, chemical amplification type photoresist and application thereof 瑞红(苏州)电子化学品股份有限公司 2024-03-29 CN claimed
US-11906900-B2 Chemically amplified positive photoresist composition for improving pattern profile YOUNG CHANG CHEMICAL CO., LTD (KR) 2024-02-20 US claimed
US-20070298176-A1 AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY GLOBALFOUNDRIES INC. (KY) 2007-12-27 US claimed
US-7312014-B2 Poly(p-hydroxystyrene/styrene/alkyl acrylate) terpolymer derivative and acid generator comprising triphenylsulfonium benzenesulfonate derivative; forming positive pattern using transcription technology in high vacuum with irradiated energy such as electron beam, extreme ultraviolet ray and X-ray WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2007-12-25 US claimed
US-7157755-B2 Polymer sacrificial light absorbing structure and method INTEL CORPORATION (US) 2007-01-02 US claimed
US-20050145890-A1 Polymer sacrificial light absorbing structure and method GOODNER MICHAEL D (US) 2005-07-07 US claimed
US-6876017-B2 Polymer sacrificial light absorbing structure and method INTEL CORPORATION (US) 2005-04-05 US claimed
US-6800418-B2 ALLOWING DEVELOPMENT WITH CONVENTIONAL DEVELOPERS AND HAVING A HIGH TRANSMITTANCE AT A F2 EXCIMER LASER WAVELENGTH OF 157 NM, HYDROPHILICITY, ADHESION TO UNDERLAYER SAMSUNG ELECTRONICS (KR) 2004-10-05 US claimed
US-20040170918-A1 Poly(p-hydroxystyrene/styrene/alkyl acrylate) terpolymer derivative and acid generator comprising triphenylsulfonium benzenesulfonate derivative; forming positive pattern using transcription technology in high vacuum with irradiated energy such as electron beam, extreme ultraviolet ray and X-ray WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2004-09-02 US claimed
US-20040157415-A1 Polymer sacrificial light absorbing structure and method INTEL CORPORATION 2004-08-12 US claimed
EP-1406123-A1 RESIST COMPOSITIONS Wako Pure Chemical Industries, Ltd. (JP) 2004-04-07 EP claimed
US-20030157430-A1 Fluorine-containing photosensitive polymer having hydrate structure and resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. 2003-08-21 US claimed