SCHEMBL2157672

SCHEMBL2157672

CC(C)N=C(NC(C)C)C(=O)[O-].[Cu+]

nearest known ligand 0.32

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA12 O43570 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32
MMP9 P14780 1/20 0.32
MMP8 P22894 1/20 0.32
CA9 Q16790 1/20 0.32
TSHR P16473 1/20 0.32
ALDH1A1 P00352 1/20 0.30
GAA P10253 1/20 0.30
RXFP1 Q9HBX9 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3926609 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
SCHEMBL2944909 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
SCHEMBL3290453 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
SCHEMBL3290634 0.96 ALDH1A1 (0.34) CA12CA1CA2MMP1MMP2
SCHEMBL17536213 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
Lithium Ion SCHEMBL1005375 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
SCHEMBL2941025 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
SCHEMBL1785154 0.96 CA12 (0.32) CA12CA1CA2MMP1MMP2
Carbon Monoxide SCHEMBL3924423 0.92 CA12 (0.30) CA12CA1CA2MMP1MMP2
SCHEMBL336859 0.77 ALDH1A1 (0.37) CA12CA1CA2MMP1MMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11952658-B2 Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material ASM IP HOLDING B.V. (NL) 2024-04-09 US disclosed
US-11814715-B2 Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material ASM IP HOLDING B.V. (NL) 2023-11-14 US disclosed
US-20230067660-A1 CYCLIC DEPOSITION METHODS FOR FORMING METAL-CONTAINING MATERIAL AND FILMS AND STRUCTURES INCLUDING THE METAL-CONTAINING MATERIAL ASM IP HOLDING B.V. (NL) 2023-03-02 US disclosed
US-20220389583-A1 CYCLIC DEPOSITION METHODS FOR FORMING METAL-CONTAINING MATERIAL AND FILMS AND STRUCTURES INCLUDING THE METAL-CONTAINING MATERIAL ASM IP HOLDING B.V. (NL) 2022-12-08 US disclosed
US-11161857-B2 Metal bicyclic amidinates PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2021-11-02 US disclosed
US-20210317576-A1 CYCLIC DEPOSITION METHODS FOR FORMING METAL-CONTAINING MATERIAL AND FILMS AND STRUCTURES INCLUDING THE METAL-CONTAINING MATERIAL ASM IP HOLDING B.V. (NL) 2021-10-14 US disclosed
US-20210013042-A1 METHODS FOR FORMING A METALLIC FILM ON A SUBSTRATE BY CYCLICAL DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES ASM IP HOLDING B.V. (NL) 2021-01-14 US disclosed
US-10741403-B2 Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures ASM IP HOLDING B.V. (NL) 2020-08-11 US disclosed
US-20200083054-A1 METHODS FOR FORMING A METALLIC FILM ON A SUBSTRATE BY CYCLICAL DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES ASM IP HOLDING B.V. (NL) 2020-03-12 US disclosed
WO-2020002995-A1 CYCLIC DEPOSITION METHODS FOR FORMING METAL-CONTAINING MATERIAL AND FILMS AND STRUCTURES INCLUDING THE METAL-CONTAINING MATERIAL ASM IP HOLDING B.V. (NL) 2020-01-02 WO disclosed
US-7973189-B2 Cobalt nitride layers for copper interconnects and methods for forming them PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2011-07-05 US disclosed
US-7737290-B2 Atomic layer deposition using metal amidinates PRESIDENT AND FELLOWS OF HARVARD UNIVERSITY (US) 2010-06-15 US disclosed
EP-2182088-A1 Atomic layer deposition using metal amidinates President and Fellows of Harvard College (US) 2010-05-05 EP disclosed
US-20100092667-A1 ATOMIC LAYER DEPOSITION USING METAL AMIDINATES PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2010-04-15 US disclosed
EP-1563117-B1 ATOMIC LAYER DEPOSITION USING METAL AMIDINATES HARVARD COLLEGE (US) 2010-01-06 EP disclosed
US-20090291208-A1 ATOMIC LAYER DEPOSITION USING METAL AMIDINATES PRESIDENT AND FELLOWS OF HARVARD COLLEGE 2009-11-26 US disclosed
US-7557229-B2 Atomic layer deposition using metal amidinates PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2009-07-07 US disclosed
US-7557229-B2 Atomic layer deposition using metal amidinates PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2009-07-07 US disclosed
US-20080254232-A1 Nucleation, adhesion to copper wires; chemical vapor deposition of cobalt amidate ; diffusion barrier for copper; microelectronics PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2008-10-16 US disclosed
US-20060141155-A1 Atomic layer deposition using metal amidinates HAVARD UNIVERSITY 2006-06-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11161857-B2 Metal bicyclic amidinates SCO2, HAO2, AOC2 CA12 1040/4885CA1 108/4885CA2 552/4885
US-20100092667-A1 ATOMIC LAYER DEPOSITION USING METAL AMIDINATES NIT2, SLC9B2, NOS2 CA12 699/4885CA1 153/4885CA2 377/4885
US-20090291208-A1 ATOMIC LAYER DEPOSITION USING METAL AMIDINATES NIT2, SLC9B2, NOS2 CA12 699/4885CA1 153/4885CA2 377/4885
US-20080254232-A1 Nucleation, adhesion to copper wires; chemical vapor deposition of cobalt amidate ; diffusion barrier for copper; microelectronics NIT2, MYB, INA CA12 405/4885CA1 75/4885CA2 275/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.