SCHEMBL218470

SCHEMBL218470

C=C(C)C(=O)OCOC1C2CC3CC(C2)CC1C3

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
TSHR P16473 3/20 0.38
THRB P10828 1/20 0.36
FDFT1 P37268 1/20 0.33
HSD11B1 P28845 5/20 0.33
EPHX1 P07099 1/20 0.31
CYP2C9 P11712 1/20 0.31
SCN9A Q15858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23332998 0.86 HSD11B1 (0.34) FDFT1HSD11B1EPHX1CYP2C9SCN9A
SCHEMBL14962547 0.85 THRB (0.46) ALDH1A1TSHRTHRBFDFT1HSD11B1
SCHEMBL2739903 0.82 HSD11B1 (0.36) ALDH1A1FDFT1HSD11B1EPHX1SCN9A
SCHEMBL13445836 0.81 ALDH1A1 (0.42) ALDH1A1TSHRTHRBEPHX1
SCHEMBL855811 0.81 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL12190125 0.81 HSD11B1 (0.34) HSD11B1
SCHEMBL13963899 0.79 NPSR1 (0.38) ALDH1A1TSHR
SCHEMBL13963895 0.79 PRKCA (0.38) ALDH1A1HSD11B1
SCHEMBL14982817 0.79
SCHEMBL14616361 0.78 MAPK1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 206 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250293030-A1 SOLUBILITY SWITCH TOPOGRAPHIC FILL MATERIALS AND METHODS BREWER SCIENCE, INC. 2025-09-18 US claimed
US-20250293030-A1 SOLUBILITY SWITCH TOPOGRAPHIC FILL MATERIALS AND METHODS BREWER SCIENCE, INC. 2025-09-18 US disclosed
US-20240158662-A1 TWO-COMPONENT CURABLE COATING AGENT AND MULTILAYER FILM HARIMA CHEMICALS, INC. (JP) 2024-05-16 US disclosed
US-20240150607-A1 TWO-COMPONENT CURABLE COATING AGENT AND MULTILAYER FILM HARIMA CHEMICALS, INC. (JP) 2024-05-09 US disclosed
CN-117083354-A Two-component curable coating agent and multilayer film 哈利玛化成株式会社 2023-11-17 CN disclosed
CN-117062882-A Two-component curable coating agent and multilayer film 哈利玛化成株式会社 2023-11-14 CN disclosed
US-20230305398-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
WO-2022191143-A1 TWO-PACK TYPE CURABLE COATING AGENT AND MULTILAYER FILM ハリマ化成株式会社 2022-09-15 WO disclosed
WO-2022191144-A1 TWO-PACK TYPE CURABLE COATING AGENT AND MULTILAYER FILM ハリマ化成株式会社 2022-09-15 WO disclosed
US-20210397098-A1 CHEMICAL LIQUID, RINSING SOLUTION, AND RESIST PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2021-12-23 US disclosed
EP-1882981-A1 POSITIVE-WORKING RESIST COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION TOKYO OHKA KOGYO CO., LTD. (JP) 2008-01-30 EP disclosed
US-20070264592-A1 Resist polymer, preparing method, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-11-15 US disclosed
US-20070264592-A1 Resist polymer, preparing method, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-11-15 US disclosed
US-20070224520-A1 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2007-09-27 US disclosed
US-20070224520-A1 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2007-09-27 US disclosed
US-20070207408-A1 Polymers, positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-09-06 US disclosed
US-20070148594-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-06-28 US disclosed
US-20070072115-A1 Positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-29 US disclosed
EP-1717261-A1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-11-02 EP disclosed
US-20050227174-A1 Positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2005-10-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070224520-A1 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern ADH1A, ADH1C, POLR1A ALDH1A1 56/4885TSHR 4198/4885THRB 4287/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.