SCHEMBL22769989

SCHEMBL22769989

C=C(F)C(=O)OC12CC3CC(CC(C3)C1)C2

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 4/20 0.38
NAAA Q02083 1/20 0.36
NPSR1 Q6W5P4 3/20 0.36
TSHR P16473 1/20 0.36
CYP17A1 P05093 3/20 0.35
EPHX2 P34913 2/20 0.35
TGM2 P21980 1/20 0.34
CA2 P00918 1/20 0.33
EPHX1 P07099 1/20 0.33
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
HTT P42858 1/20 0.31
KMT2A Q03164 1/20 0.31
GLA P06280 1/20 0.31
THRB P10828 1/20 0.31
CYP2C9 P11712 1/20 0.31
GAA P10253 1/20 0.30
SCN1A P35498 1/20 0.30
SCN2A Q99250 1/20 0.30
SCN3A Q9NY46 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16369107 0.83 CYP19A1 (0.40) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL14523960 0.83 PKM (0.37) ALDH1A1
SCHEMBL27736443 0.83 CYP19A1 (0.44) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL21392499 0.82 CYP19A1 (0.39) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL8399502 0.82 CYP19A1 (0.39) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL5146387 0.81 TSHR (0.39) TSHR
SCHEMBL45476 0.80 NAAA (0.40) CYP19A1NAAANPSR1CYP17A1EPHX2
SCHEMBL906474 0.80 CYP19A1 (0.38) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL954294 0.79 TGM2 (0.38) CYP19A1NAAANPSR1TSHRCYP17A1
SCHEMBL2517522 0.79 CYP19A1 (0.42) CYP19A1NAAANPSR1TSHRCYP17A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117946592-A Low-dielectric-constant organic barrier layer photo-curing adhesive and use method and application thereof 西安思摩威新材料有限公司 2024-04-30 CN claimed
WO-2024128040-A1 ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD 富士フイルム株式会社 2024-06-20 WO disclosed
CN-117946592-A Low-dielectric-constant organic barrier layer photo-curing adhesive and use method and application thereof 西安思摩威新材料有限公司 2024-04-30 CN disclosed
CN-117946592-A Low-dielectric-constant organic barrier layer photo-curing adhesive and use method and application thereof 西安思摩威新材料有限公司 2024-04-30 CN disclosed
US-11960207-B2 Resist composition and resist film ZEON CORPORATION (JP) 2024-04-16 US disclosed
US-20210055654-A1 RESIST COMPOSITION AND RESIST FILM ZEON CORPORATION (JP) 2021-02-25 US disclosed
EP-3751345-A1 RESIST COMPOSITION AND RESIST FILM Zeon Corporation (JP) 2020-12-16 EP disclosed
CN-111587402-A Resist composition and resist film 日本瑞翁株式会社 2020-08-25 CN disclosed