SCHEMBL2298661

SCHEMBL2298661

O=C(NSc1cccc(Cl)c1)NSc1cccc(Cl)c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 6/20 0.48
KMT2A Q03164 6/20 0.48
MAPT P10636 5/20 0.48
LMNA P02545 2/20 0.48
HTT P42858 2/20 0.48
ALDH1A1 P00352 1/20 0.48
RAB9A P51151 5/20 0.44
NPC1 O15118 4/20 0.44
PARP1 P09874 1/20 0.41
TERT O14746 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
HTR3E A5X5Y0 1/20 0.40
HTR3B O95264 1/20 0.40
HTR3A P46098 1/20 0.40
HTR3D Q70Z44 1/20 0.40
HTR3C Q8WXA8 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19632078 0.85 LMNA (0.44) MEN1KMT2AMAPTLMNAHTT
SCHEMBL27301554 0.85 PARP1 (0.47) MEN1KMT2AMAPTLMNAHTT
SCHEMBL10679757 0.85 MEN1 (0.42) MEN1KMT2AMAPTLMNAHTT
SCHEMBL28982445 0.77 IDO1 (0.40) MEN1KMT2AMAPTALDH1A1CYP1A2
SCHEMBL132621 0.74 SMN1; SMN2 (0.46) MEN1KMT2AMAPTLMNAHTT
SCHEMBL31091097 0.74 FBP1 (0.58) MEN1KMT2AMAPTLMNAHTT
SCHEMBL225086 0.74 FBP1 (0.58) MEN1KMT2AMAPTLMNAHTT
SCHEMBL8538803 0.73 TERT (0.48) MEN1KMT2AMAPTLMNAHTT
SCHEMBL10865438 0.73 ALDH1A1 (0.51) MEN1KMT2AMAPTLMNAHTT
SCHEMBL1821162 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7993732-B2 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-09 US disclosed
US-20090130441-A1 HEAT-SENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-05-21 US disclosed
US-20080026205-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-01-31 US disclosed