SCHEMBL234097

SCHEMBL234097

C(OCC1CO1)C1CO1.CCC(c1cc(Br)c(O)c(Br)c1)c1cc(Br)c(O)c(Br)c1

nearest known ligand 0.36

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
TDP1 Q9NUW8 2/20 0.34
TSHR P16473 3/20 0.33
MAPK1 P28482 1/20 0.33
CYP2C19 P33261 1/20 0.32
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
HIF1A Q16665 1/20 0.31
FOLH1 Q04609 1/20 0.30
MAOA P21397 1/20 0.30
ESR1 P03372 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9053991 0.80 TSHR (0.50) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL234098 0.79 TDP1 (0.40) ALDH1A1SMN1; SMN2TDP1TSHRTP53
SCHEMBL27924079 0.78 SMN1; SMN2 (0.40) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL232506 0.78 ESR1 (0.42) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL7574561 0.77 TSHR (0.58) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL8677759 0.76 BCHE (0.38) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL27994199 0.75 TDP1 (0.49) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL3681261 0.73 TSHR (0.44) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL4645429 0.73 TDP1 (0.33) ALDH1A1SMN1; SMN2TDP1TSHRTP53
SCHEMBL4782428 0.73 ESR1 (0.35) ALDH1A1TDP1TSHRCYP2C19CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116057043-B Urea derivatives and their use as curing agents and curing accelerators for resin systems 赫克塞尔合成有限公司 2024-04-16 CN disclosed
US-11939421-B2 Or relating to curing agents HEXCEL COMPOSITES LIMITED (GB) 2024-03-26 US disclosed
US-11879052-B2 Curatives HEXCEL COMPOSITES LIMITED (GB) 2024-01-23 US disclosed
US-11702516-B2 Curative composition and a resin composition containing the curative composition HEXCEL COMPOSITES LIMITED (GB) 2023-07-18 US disclosed
EP-4196462-A1 UREA DERIVATIVES AND THEIR USE AS CURATIVES AND CURATIVE ACCELERATORS FOR RESIN SYSTEMS Hexcel Composites Limited (GB) 2023-06-21 EP disclosed
US-20230167272-A1 IMPROVEMENTS IN OR RELATING TO CURATIVES HEXCEL COMPOSITES LIMITED (GB) 2023-06-01 US disclosed
CN-116057043-A Urea derivatives and their use as curing agents and curing accelerators for resin systems 赫克塞尔合成有限公司 2023-05-02 CN disclosed
EP-4017904-A1 IMPROVED THERMOCURABLE MOULDING PROCESS Hexcel Composites Limited (GB) 2022-06-29 EP disclosed
WO-2022034201-A1 UREA DERIVATIVES AND THEIR USE AS CURATIVES AND CURATIVE ACCELERATORS FOR RESIN SYSTEMS HEXCEL COMPOSITES LIMITED (GB) 2022-02-17 WO disclosed
EP-3950849-A1 LATENT HEAT STORAGE MATERIAL Kaneka Corporation (JP) 2022-02-09 EP disclosed
US-20130158231-A1 LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE AGENT CONTAINING SAME NIPPON SODA CO., LTD. (JP) 2013-06-20 US disclosed
US-20120088920-A1 CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN NIPPON SODA CO., LTD. (JP) 2012-04-12 US disclosed
EP-2410001-A1 INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR Nippon Soda Co., Ltd. (JP) 2012-01-25 EP disclosed
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR NIPPON SODA CO., LTD. 2012-01-05 US disclosed
US-20100022744-A1 CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN NIPPON SODA CO., LTD. (JP) 2010-01-28 US disclosed
EP-2103600-A1 CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN Nippon Soda Co., Ltd. (JP) 2009-09-23 EP disclosed
EP-0761722-B1 ORGANOPOLYSILOXANE DERIVATIVE NAGASE CIBA LTD (JP) 2002-06-12 EP disclosed
US-5844053-A Organo-polysiloxane derivartives NAGASE-CIBA, LTD. (JP) 1998-12-01 US disclosed
EP-0761722-A1 ORGANOPOLYSILOXANE DERIVATIVE Nagase-Ciba Ltd. (JP) 1997-03-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120004377-A1 CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR SEM1, RCC1, BMI1 ALDH1A1 619/4885SMN1; SMN2 918/4885TDP1 889/4885
US-20100022744-A1 CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN HEATR1, NISCH, HEATR6 ALDH1A1 1369/4885SMN1; SMN2 2840/4885TDP1 3822/4885
US-20120004349-A1 Epoxy resin composition, curing agent, and curing accelerator DCTN1, ARCN1, UNC119 ALDH1A1 338/4885SMN1; SMN2 2196/4885TDP1 1130/4885
US-11939421-B2 Or relating to curing agents FABP4, RARA, ADIPOR1 ALDH1A1 131/4885SMN1; SMN2 2881/4885TDP1 1408/4885
US-20120088920-A1 CLATHRATE COMPOUND, CURING CATALYST, COMPOSITION FOR FORMING CURED RESIN, AND CURED RESIN HEATR1, CBR1, ASIC1 ALDH1A1 1412/4885SMN1; SMN2 3025/4885TDP1 4014/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.