Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR | P00374 | 3/20 | 0.54 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.47 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.47 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.47 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.47 |
| ▸ | SHBG | P04278 | 1/20 | 0.47 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.46 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.40 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.39 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.39 |
| ▸ | BACE1 | P56817 | 1/20 | 0.38 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30003843 | 1.00 | DHFR (0.54) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL4364941 | 0.95 | DHFR (0.53) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL12680554 | 0.93 | HSPA5 (0.55) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL30004950 | 0.90 | SHBG (0.58) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL30003742 | 0.90 | SHBG (0.63) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL4065757 | 0.90 | SHBG (0.58) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL2385253 | 0.90 | SHBG (0.58) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL2384360 | 0.90 | SHBG (0.63) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL22408778 | 0.89 | DHFR (0.50) | DHFRPTPN1PTPN2PTPN6HSPA5 | |
| SCHEMBL4053628 | 0.88 | ESR1 (0.52) | DHFRPTPN1PTPN2PTPN6HSPA5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-1623274-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-02-08 | — | — | EP | claimed |
| EP-1614005-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-01-11 | — | — | EP | claimed |
| US-6905809-B2 | Photoresist compositions | CLARIANT FINANCE (BVI) LIMITED (VG) | 2005-06-14 | — | — | US | claimed |
| WO-2004088424-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| WO-2004088423-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| US-20040197696-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-20040197704-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-6790582-B1 | NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT | CLARIANT FINANCE BVI LIMITED (VG) | 2004-09-14 | — | — | US | claimed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| EP-3896522-B1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-11487200-B2 | Positive-type photosensitive resin composition and cured film prepared therefrom | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. | 2022-11-01 | — | — | US | disclosed |
| EP-3961676-A1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-02 | — | — | EP | disclosed |
| US-6296992-B1 | CONTACT APERTURES BY PHASE SHIFT METHOD WITH PHOTORESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-10-02 | — | — | US | disclosed |
| US-6207788-B1 | FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE | TOKYO OHKA KOGYA CO., LTD. (JP) | 2001-03-27 | — | — | US | disclosed |
| US-6187500-B1 | PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-02-13 | — | — | US | disclosed |
| US-6177226-B1 | PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-23 | — | — | US | disclosed |
| EP-0902326-A2 | Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-03-17 | — | — | EP | disclosed |