SCHEMBL30003843

SCHEMBL30003843

CCc1cc(Cc2cc(Cc3cc(CC)c(O)c(Cc4cc(CC)c(O)c(CC)c4)c3)cc(CC)c2O)cc(CC)c1O

nearest known ligand 0.54

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
DHFR P00374 3/20 0.54
PTPN1 P18031 2/20 0.47
PTPN2 P17706 1/20 0.47
PTPN6 P29350 1/20 0.47
HSPA5 P11021 1/20 0.47
SHBG P04278 1/20 0.47
GABRA1 P14867 1/20 0.46
GABRB2 P47870 1/20 0.46
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2C9 P11712 1/20 0.40
HMGB1 P09429 1/20 0.39
CXCL12 P48061 1/20 0.39
BACE1 P56817 1/20 0.38
AMY1A P0DUB6 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2387607 1.00 DHFR (0.54) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL4364941 0.95 DHFR (0.53) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL12680554 0.93 HSPA5 (0.55) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL30004950 0.90 SHBG (0.58) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL30003742 0.90 SHBG (0.63) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL4065757 0.90 SHBG (0.58) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL2385253 0.90 SHBG (0.58) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL2384360 0.90 SHBG (0.63) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL22408778 0.89 DHFR (0.50) DHFRPTPN1PTPN2PTPN6HSPA5
SCHEMBL4053628 0.88 ESR1 (0.52) DHFRPTPN1PTPN2PTPN6HSPA5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-118295211-A Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board 深圳市容大感光科技股份有限公司 2024-07-05 CN disclosed
CN-117939914-A Structure, display element, pattern for partition wall, and method for forming the same 东京应化工业株式会社 2024-04-26 CN disclosed
CN-117850163-A Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board 深圳市容大感光科技股份有限公司 2024-04-09 CN disclosed
CN-111205648-B Curable composition, cured product, microlens, and optical element 东京应化工业株式会社 2023-12-08 CN disclosed
CN-116360213-A Resin composition and photoresist patterning method using the same 深圳市容大感光科技股份有限公司 2023-06-30 CN disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
CN-108884574-B Coating agent for forming metal oxide film and method for producing substrate having metal oxide film 东京应化工业株式会社 2022-10-14 CN disclosed