SCHEMBL278271

SCHEMBL278271

Cc1cc(Cc2ccc(O)cc2)c(O)cc1O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.50
KEAP1 Q14145 1/20 0.50
MEN1 O00255 1/20 0.49
KMT2A Q03164 1/20 0.49
ESR1 P03372 3/20 0.48
ESR2 Q92731 3/20 0.48
ALOX5 P09917 2/20 0.47
KDM4E B2RXH2 1/20 0.40
ALDH1A1 P00352 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2D6 P10635 1/20 0.40
G6PD P11413 1/20 0.40
CYP2C9 P11712 1/20 0.40
PKM P14618 1/20 0.40
HPGD P15428 1/20 0.40
ALOX15 P16050 1/20 0.40
ALOX12 P18054 1/20 0.40
MAPK1 P28482 1/20 0.40
CYP2C19 P33261 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28158802 0.89 KEAP1 (0.50) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL217308 0.86 MAPT (0.59) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL14564525 0.85 KEAP1 (0.50) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL278396 0.81 ALDH1A1 (0.46) MAPTMEN1KMT2AESR1ESR2
SCHEMBL14998892 0.81 MAPT (0.50) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL8357015 0.80 ESR1 (0.69) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL20137003 0.80 ESR1 (0.52) MAPTKEAP1MEN1KMT2AESR1
SCHEMBL8052862 0.78 ESR1 (0.73) MAPTESR1ESR2ALOX5CYP1A2
SCHEMBL19314128 0.78 SHBG (0.50) MAPTESR1ESR2KDM4EALDH1A1
SCHEMBL4058622 0.78 KEAP1 (0.52) MAPTKEAP1MEN1KMT2AESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3235803-B1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHINETSU CHEMICAL CO (JP) 2020-06-03 EP disclosed
EP-3214497-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE SHINETSU CHEMICAL CO (JP) 2019-08-07 EP disclosed
EP-2957955-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE SHINETSU CHEMICAL CO (JP) 2018-06-06 EP disclosed
EP-3235803-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM Shin-Etsu Chemical Co., Ltd. (JP) 2017-10-25 EP disclosed
EP-3214497-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE Shin-Etsu Chemical Co., Ltd. (JP) 2017-09-06 EP disclosed
US-9235116-B2 Actinic-ray- or radiation sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern FUJIFILM CORPORATION (JP) 2016-01-12 US disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT RARA, AASDHPPT, GABRP MAPT 1103/4885KEAP1 4025/4885MEN1 4464/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.