Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KEAP1 | Q14145 | 1/20 | 0.50 |
| ▸ | ESR1 | P03372 | 2/20 | 0.48 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.43 |
| ▸ | DRD2 | P14416 | 1/20 | 0.40 |
| ▸ | DRD1 | P21728 | 1/20 | 0.40 |
| ▸ | DRD3 | P35462 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18744075 | 0.85 | KEAP1 (0.50) | KEAP1ESR1ESR2MEN1MAPT | |
| SCHEMBL23919938 | 0.83 | AMY1A (0.47) | ESR1ESR2MEN1MAPTKMT2A | |
| SCHEMBL29450506 | 0.82 | KEAP1 (0.55) | KEAP1ESR1ESR2MEN1MAPT | |
| SCHEMBL278269 | 0.82 | KEAP1 (0.55) | KEAP1ESR1ESR2MEN1MAPT | |
| SCHEMBL8066762 | 0.76 | ESR1 (0.52) | KEAP1ESR1ESR2MEN1MAPT | |
| SCHEMBL8430738 | 0.74 | MAPT (0.45) | KEAP1MEN1MAPTKMT2A | |
| SCHEMBL278767 | 0.74 | AMY1A (0.44) | ESR1ESR2 | |
| SCHEMBL7705071 | 0.74 | ESR1 (0.59) | KEAP1ESR1ESR2MAPTALOX5 | |
| SCHEMBL2865086 | 0.74 | KEAP1 (0.52) | KEAP1ESR1ESR2MEN1MAPT | |
| SCHEMBL15468220 | 0.74 | ESR1 (0.50) | KEAP1ESR1ESR2MEN1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| US-8269358-B2 | Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2012-09-18 | — | — | US | disclosed |
| US-8269358-B2 | Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2012-09-18 | — | — | US | disclosed |
| US-8198006-B2 | Process for producing semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-20100183985-A1 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-07-22 | — | — | US | disclosed |
| US-20100044888-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-02-25 | — | — | US | disclosed |
| US-20100044888-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-02-25 | — | — | US | disclosed |
| US-7368205-B2 | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-05-06 | — | — | US | disclosed |
| US-7368205-B2 | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-05-06 | — | — | US | disclosed |
| US-7361445-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY (JP) | 2008-04-22 | — | — | US | disclosed |
| US-7361445-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY (JP) | 2008-04-22 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-7238455-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-7238455-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100044888-A1 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT | RARA, AASDHPPT, GABRP | KEAP1 4025/4885ESR1 403/4885ESR2 1422/4885 |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CD79B, BRIX1, SMARCB1 | KEAP1 2891/4885ESR1 383/4885ESR2 1987/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.