SCHEMBL283322

SCHEMBL283322

C=Cc1ccc2cc(OC(C)OCC)ccc2c1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.36
AHR P35869 1/20 0.36
AKR1C3 P42330 1/20 0.35
AKR1C2 P52895 1/20 0.35
PPARG P37231 4/20 0.35
PPARA Q07869 4/20 0.35
PPARD Q03181 2/20 0.35
CHRNB4 P30926 2/20 0.35
CHRNA3 P32297 2/20 0.35
CHRNA7 P36544 2/20 0.35
CHRNB2 P17787 1/20 0.35
CHRNA4 P43681 1/20 0.35
BCHE P06276 1/20 0.34
ACHE P22303 1/20 0.34
PTGS2 P35354 1/20 0.34
HTR2C P28335 1/20 0.33
NQO2 P16083 1/20 0.33
TAS1R3 Q7RTX0 1/20 0.33
TAS1R1 Q7RTX1 1/20 0.33
RELA Q04206 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29869460 1.00 ESR1 (0.36) ESR1AHRAKR1C3AKR1C2PPARG
Ammonia Solution, Strong SCHEMBL28760276 0.98 ESR1 (0.35) ESR1AHRAKR1C3AKR1C2PPARG
SCHEMBL3901021 0.97 CHRNB4 (0.36) ESR1AHRAKR1C3AKR1C2PPARG
SCHEMBL134315 0.85 CHRNB2 (0.42) ESR1AHRPPARGPPARAPPARD
SCHEMBL4057110 0.85 LMNA (0.44) AKR1C3AKR1C2PPARGPPARAPPARD
SCHEMBL3858045 0.85 ALDH1A3 (0.45) ESR1AHRAKR1C3AKR1C2PPARG
SCHEMBL409170 0.84 TP53 (0.42) CHRNA7PTGS2RELALMNA
Methacrylic Acid SCHEMBL3902780 0.83 ESR1 (0.38) ESR1AKR1C3AKR1C2PPARGPPARA
SCHEMBL23559184 0.81 CHRNB2 (0.40) ESR1AHRCHRNB4CHRNA3CHRNA7
SCHEMBL13845307 0.79 PPARG (0.50) PPARGPPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
CN-109843853-B Composition and method for manufacturing device using the same 东洋合成工业株式会社 2022-09-20 CN disclosed
US-11256169-B2 Resist composition, and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2022-02-22 US disclosed
US-20210405531-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-12-30 US disclosed
US-11142495-B2 Composition and method for manufacturing device using same TOYO GOSEI CO., LTD. (JP) 2021-10-12 US disclosed
US-20210157234-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-27 US disclosed
US-20210149302-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-20 US disclosed
US-20210055656-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-25 US disclosed
US-10719014-B2 Photoresists comprising amide component ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2020-07-21 US disclosed
US-20110183263-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-07-28 US disclosed
US-20110183263-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2011-07-28 US disclosed
US-7592125-B2 Chemically-amplified positive photoresist compositions that contain a photoactive component and blend of at least two distinct resins; a first resin that comprises hydroxy naphthyl groups and a second cross-linked resin; reduced line edge roughness ROHM AND HAAS ELECTRIC MATERIALS LLC (US) 2009-09-22 US disclosed
US-7491483-B2 Polymers, positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-02-17 US disclosed
US-20080032232-A1 Novel resins and photoresist compositions comprising same SHIPLEY COMPANY, L.L.C. (US) 2008-02-07 US disclosed
US-20070207408-A1 Polymers, positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-09-06 US disclosed
US-7244542-B2 Resins and photoresist compositions comprising same SHIPLEY COMPANY, L.L.C. (US) 2007-07-17 US disclosed
EP-1684120-A1 Photresist compositions comprising resin blends Rohm and Haas Electronic Materials LLC (US) 2006-07-26 EP disclosed
US-20060160022-A1 Chemically-amplified positive photoresist compositions that contain a photoactive component and blend of at least two distinct resins; a first resin that comprises carbocyclic aryl units with hetero substitution and a second cross-linked resin ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2006-07-20 US disclosed
US-20040038150-A1 Novel resins and photoresist compositions comprising same SHIPLEY COMPANY, L.L.C. 2004-02-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11693313-B2 Resist composition and method of forming resist pattern C1R, C1S, C9 ESR1 810/4885AHR 119/4885AKR1C3 123/4885
US-10719014-B2 Photoresists comprising amide component ASPH, ALAD, SUN2 ESR1 673/4885AHR 98/4885AKR1C3 1645/4885
US-11142495-B2 Composition and method for manufacturing device using same LBR, LMTK2, MMS19 ESR1 1782/4885AHR 2420/4885AKR1C3 3041/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.