SCHEMBL30209232

SCHEMBL30209232

O=C(O)c1ccc(CO)c(CO)c1-c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
WDR5 P61964 1/20 0.44
HNF4A P41235 2/20 0.43
DCLRE1A Q6PJP8 1/20 0.42
DCLRE1B Q9H816 1/20 0.42
KDM4E B2RXH2 3/20 0.40
ACMSD Q8TDX5 2/20 0.40
MAPT P10636 1/20 0.40
PIM1 P11309 1/20 0.40
GFER P55789 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
PTPN1 P18031 5/20 0.39
PTPN2 P17706 2/20 0.39
PTPN6 P29350 2/20 0.39
ALDH1A1 P00352 3/20 0.39
ALOX15 P16050 1/20 0.39
FOLH1 Q04609 1/20 0.38
HMGB1 P09429 1/20 0.37
CXCL12 P48061 1/20 0.37
FABP3 P05413 1/20 0.37
FABP4 P15090 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29137938 0.81 AKR1C2 (0.42) WDR5HNF4ADCLRE1ADCLRE1BKDM4E
SCHEMBL3843394 0.79 HNF4A (0.55) WDR5HNF4AKDM4EMAPTPIM1
SCHEMBL332581 0.77 ALDH1A1 (0.57) WDR5HNF4ADCLRE1ADCLRE1BKDM4E
SCHEMBL22190013 0.75 ALDH1A1 (0.46) WDR5HNF4ADCLRE1ADCLRE1BKDM4E
SCHEMBL31097884 0.74 SELL (0.47) HNF4AKDM4EMAPTTDP1ALDH1A1
SCHEMBL901069 0.73 ACMSD (0.61) WDR5HNF4ADCLRE1ADCLRE1BKDM4E
SCHEMBL1930918 0.72 PDCD1 (0.48) KDM4EMAPTALDH1A1HPGD
SCHEMBL11691857 0.72 FABP4 (0.43) WDR5HNF4ADCLRE1ADCLRE1BKDM4E
SCHEMBL7863116 0.72 PTPN1 (0.50) HNF4ADCLRE1ADCLRE1BACMSDPTPN1
SCHEMBL17986153 0.72 BACE1 (0.50) HNF4AKDM4EMAPTTDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115718406-A Photosensitive resin composition for forming resist, resin film, cured film, and semiconductor device 住友电木株式会社 2023-02-28 CN disclosed