SCHEMBL306036

SCHEMBL306036

O=C(c1ccc(CS)cc1)C1(N2CCOCC2)CCCCC1

nearest known ligand 0.44

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.44
LMNA P02545 2/20 0.44
HPGD P15428 2/20 0.41
SMN1; SMN2 Q16637 3/20 0.38
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
KMT2A Q03164 1/20 0.38
CRHBP P24387 1/20 0.37
CRHR2 Q13324 1/20 0.37
CTSL P07711 1/20 0.37
CTSB P07858 1/20 0.37
CTSS P25774 1/20 0.37
CTSK P43235 1/20 0.37
ALDH1A1 P00352 1/20 0.37
HIF1A Q16665 1/20 0.36
EPAS1 Q99814 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13863437 0.89 ALDH1A1 (0.41) HPGDNPC1KMT2AALDH1A1TSHR
SCHEMBL12855171 0.88 THRB (0.44) THRBLMNAHPGDSMN1; SMN2NPC1
SCHEMBL12013268 0.85 LMNA (0.43) THRBLMNAHPGDSMN1; SMN2RAB9A
SCHEMBL10458636 0.83 THRB (0.44) THRBLMNAHPGDSMN1; SMN2KMT2A
SCHEMBL9680457 0.82 GSK3B (0.49) THRBLMNAHPGDSMN1; SMN2NPC1
SCHEMBL10458802 0.82 ATM (0.43) THRBLMNAHPGDSMN1; SMN2KMT2A
SCHEMBL9681734 0.80 CYP3A4 (0.54) LMNAHPGDSMN1; SMN2KMT2AALDH1A1
SCHEMBL274970 0.79 SMN1; SMN2 (0.51) THRBLMNAHPGDSMN1; SMN2NPC1
SCHEMBL9679446 0.79 MAPT (0.47) THRBLMNAHPGDSMN1; SMN2KMT2A
SCHEMBL10458478 0.79 FKBP1A (0.51) LMNAHPGDSMN1; SMN2NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8273520-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
EP-0949540-B1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJIFILM CORP (JP) 2012-05-02 EP disclosed
US-20120082836-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-04-05 US disclosed
US-20120082836-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-04-05 US disclosed
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
EP-1096314-B1 Lithographic printing plate precursor FUJIFILM CORP (JP) 2011-10-19 EP disclosed
US-20110088934-A1 METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME FUJIFILM CORPORATION (JP) 2011-04-21 US disclosed
US-20110088934-A1 METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME FUJIFILM CORPORATION (JP) 2011-04-21 US disclosed
US-7879535-B2 A fine conductive metal pattern superior in heat resistance, adhesion property to a base surface and durability on a polyimide surface; simplification; grafting an acylic monomer on polyimide to interact with electroless plating catalyst; reduction of metal salt in defined pattern; printed circuit FUJIFILM CORPORATION (JP) 2011-02-01 US disclosed
US-7790348-B2 Decomposable resin composition and flexographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2010-09-07 US disclosed
US-20080182205-A1 Polymer having polymerizable group, polymerizable composition, planographic printing plate precursor, and planographic printing method using the same KUNITA KAZUTO 2008-07-31 US disclosed
US-20080161476-A1 A binder polymer mixed with polysaccharide-modified carbon nanotubes or fullerenes and a monomer; efficient engraving with a low laser energy; improved recyclability FUJIFILM CORPORATION (JP) 2008-07-03 US disclosed
EP-1939244-A2 Laser-decomposable resin composition, and pattern-forming material and laser-engravable flexographic printing plate precursor using the same FUJIFILM Corporation (JP) 2008-07-02 EP disclosed
US-7381517-B2 Curable composition and image forming material containing the same FUJIFILM CORPORATION (JP) 2008-06-03 US disclosed
US-20080096132-A1 mixing a polymerizable monomer in which acrylonitrile accounts for 70% by weight or more of a total of the polymerizable monomer, water and an alkali metal persulfate polymerization initiator to conduct emulsion polymerization; distilling off unpolymerized monomers; chemical resistance film, gas barrier FUJIFILM CORPORATION 2008-04-24 US disclosed
US-7351773-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2008-04-01 US disclosed
US-20080070154-A1 DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL INCLUDING THE SAME FUJIFILM CORPORATION (JP) 2008-03-20 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed
US-20080038663-A1 butadiene-styrene copolymer binder and a compound which undergoes decarboxylation due to heat, generates carbon dioxide gas, assists thermal decomposition of the coexisting binder polymer; high engraving sensitivity with low laser energy; forming flexographic printing plate FUJIFILM CORPORATION (JP) 2008-02-14 US disclosed
US-7279195-B2 Method of forming metal fine particle pattern and method of forming electroconductive pattern FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed