SCHEMBL3190486

SCHEMBL3190486

CCOc1ccccc1-c1nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 2/20 0.44
TTR P02766 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.43
PDE5A O76074 1/20 0.42
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
POLB P06746 1/20 0.41
GUSB P08236 1/20 0.41
KDM4E B2RXH2 5/20 0.40
HSD17B10 Q99714 4/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
ALDH1A1 P00352 3/20 0.40
NPC1 O15118 2/20 0.40
RXFP1 Q9HBX9 2/20 0.40
HPGD P15428 2/20 0.40
PPARG P37231 1/20 0.40
STAT3 P40763 1/20 0.40
NCOA2 Q15596 1/20 0.40
LMNA P02545 2/20 0.40
RAB9A P51151 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29366362 0.84 L3MBTL1 (0.43) NPSR1L3MBTL1MEN1KMT2APOLB
SCHEMBL268758 0.84 L3MBTL1 (0.43) NPSR1L3MBTL1MEN1KMT2APOLB
SCHEMBL29353355 0.82 ALDH1A1 (0.47) NPSR1L3MBTL1KDM4EHSD17B10SMN1; SMN2
SCHEMBL649415 0.82 ALDH1A1 (0.47) NPSR1L3MBTL1KDM4EHSD17B10SMN1; SMN2
SCHEMBL8411496 0.76 L3MBTL1 (0.36) NPSR1L3MBTL1MEN1KMT2AKDM4E
SCHEMBL26105184 0.76 ALDH1A1 (0.50) NPSR1TTRL3MBTL1PDE5AMEN1
SCHEMBL10361466 0.76 ALOX5 (0.49) L3MBTL1POLBKDM4EHSD17B10ALDH1A1
SCHEMBL9566491 0.76 DHFR (0.55) NPSR1TTRL3MBTL1PDE5AMEN1
SCHEMBL7149339 0.76 NCF1 (0.42) L3MBTL1MEN1KMT2AKDM4ESMN1; SMN2
SCHEMBL11023945 0.75 S1PR1 (0.40) NPSR1L3MBTL1MEN1KMT2AGUSB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3603954-B1 POLYMER SUBSTRATE WITH HARD COAT LAYER TEIJIN LTD (JP) 2024-03-20 EP disclosed
US-11866564-B2 Polymer substrate with hard coat layer TEIJIN LIMITED (JP) 2024-01-09 US disclosed
US-11370888-B2 Silicon-rich silsesquioxane resins DOW SILICONES CORPORATION (US) 2022-06-28 US disclosed
EP-3354455-B1 POLYMER SUBSTRATE WITH HARDCOAT LAYER, AND MANUFACTURING METHOD FOR SAME TEIJIN LTD (JP) 2022-02-09 EP disclosed
US-11028284-B2 Polymer substrate with hardcoat layer, and manufacturing method for same TEIJIN LIMITED (JP) 2021-06-08 US disclosed
US-20210008851-A1 METHOD FOR PRODUCING SUBSTRATE HAVING HARD COAT LAYER CONTAINING FUNCTIONAL FINE PARTICLES TEIJIN LIMITED (JP) 2021-01-14 US disclosed
EP-3753974-A1 METHOD FOR PRODUCING SUBSTRATE HAVING HARD COAT LAYER CONTAINING FUNCTIONAL FINE PARTICLES Teijin Limited (JP) 2020-12-23 EP disclosed
US-20200377682-A1 POLYMER SUBSTRATE WITH HARD COAT LAYER TEIJIN LIMITED (JP) 2020-12-03 US disclosed
EP-3603954-A1 POLYMER SUBSTRATE WITH HARD COAT LAYER Teijin Limited (JP) 2020-02-05 EP disclosed
US-20190211155-A1 SILICON-RICH SILSESQUIOXANE RESINS DOW SILICONES CORPORATION 2019-07-11 US disclosed
US-20180196169-A1 HARD-COATING FILM FOR DISPLAY DEVICE, AND DISPLAY DEVICE COMPRISING SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-07-12 US disclosed
EP-3315545-A1 HARD-COATING FILM FOR DISPLAY DEVICE, AND DISPLAY DEVICE COMPRISING SAME Samsung Electronics Co., Ltd. (KR) 2018-05-02 EP disclosed
EP-2657263-B1 PROCESS FOR PRODUCTION OF DISPERSION, DISPERSION, COATING MATERIAL, COATING FILM, AND FILM DAINIPPON INK & CHEMICALS (JP) 2015-09-30 EP disclosed
US-20140004367-A1 METHOD FOR PRODUCING DISPERSION, DISPERSION, COATING MATERIAL, COATING FILM, AND FILM DIC CORPORATION (JP) 2014-01-02 US disclosed
EP-2657263-A1 PROCESS FOR PRODUCTION OF DISPERSION, DISPERSION, COATING MATERIAL, COATING FILM, AND FILM DIC Corporation (JP) 2013-10-30 EP disclosed
US-7666920-B2 urable molding material an epoxy (meth)acrylate, acrylated polyethers;acrylated bisphenol, and a thermoplastic resin; shape recovering; shape retension; adhesion tosubstrate; high refractive index without a decrease in elastic modulus;Fresnel lens sheet DAI NIPPON INK AND CHEMICALS, INC. (JP) 2010-02-23 US disclosed
US-20060189706-A1 Actinic-energy-ray-curable resin composition for lens sheet and lens sheet DAI NIPPON PRINTING CO., LTD. (JP) 2006-08-24 US disclosed
EP-1308471-B1 Radiation curable resin composition for Fresnel lens and Fresnel lens sheet DAINIPPON INK & CHEMICALS (JP) 2005-12-14 EP disclosed
US-6809889-B2 EPOXY (METH)ACRYLATE; (METH)ACRYLATE OF LOW MOLECULAR WEIGHT POLYOXYPROPYLENE; CYCLIC (METH)ACRYLATE (E.G., PHENOXYETHYL ACRYLATE) AND (METH)ACRYLATE OF TRIS(HYDROXYALKYL) ISOCYANURATE; HIGH ELASTIC MODULUS AND REFRACTIVE INDEX DAINIPPON INK AND CHEMICALS, INC. (JP) 2004-10-26 US disclosed
US-20030113544-A1 Radiation curable resin composition for fresnel lens and fresnel lens sheet DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-06-19 US disclosed