Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FAAH | O00519 | 1/20 | 0.39 |
| ▸ | MGLL | Q99685 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | POLB | P06746 | 2/20 | 0.36 |
| ▸ | HTT | P42858 | 2/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | HTR1A | P08908 | 1/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | HTR7 | P34969 | 1/20 | 0.32 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.31 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.31 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.31 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.31 |
| ▸ | DRD2 | P14416 | 1/20 | 0.31 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.31 |
| ▸ | DRD4 | P21917 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9315758 | 0.83 | HTT (0.38) | FAAHMGLLMEN1KMT2APOLB | |
| SCHEMBL2502691 | 0.78 | RGS4 (0.30) | — | |
| SCHEMBL28448166 | 0.77 | MAPT (0.48) | SMN1; SMN2CYP1A2CYP2C19 | |
| SCHEMBL29589380 | 0.77 | MAPT (0.48) | SMN1; SMN2CYP1A2CYP2C19 | |
| SCHEMBL29496241 | 0.74 | GNAI3 (0.32) | — | |
| SCHEMBL30183763 | 0.74 | KMT2A (0.37) | FAAHMEN1KMT2APOLBSMN1; SMN2 | |
| SCHEMBL704023 | 0.72 | THRB (0.38) | — | |
| SCHEMBL646412 | 0.72 | THRB (0.38) | — | |
| SCHEMBL1991946 | 0.71 | HRH3 (0.39) | MEN1KMT2ASMN1; SMN2CYP1A2CYP2C19 | |
| SCHEMBL6007776 | 0.70 | THRB (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 158 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111607227-B | Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-02-28 | — | — | CN | claimed |
| CN-115561966-A | Chemical amplification type negative photosensitive polyimide coating adhesive and application | 明士(北京)新材料开发有限公司 | 2023-01-03 | — | — | CN | claimed |
| CN-114874441-A | Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-08-09 | — | — | CN | claimed |
| CN-114488690-A | Chemical amplification type negative polyimide photoresist and preparation method and application thereof | 中国科学院化学研究所 | 2022-05-13 | — | — | CN | claimed |
| CN-111522200-B | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2021-07-27 | — | — | CN | claimed |
| CN-111522200-A | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2020-08-11 | — | — | CN | claimed |
| WO-2026100734-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100079-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-5397682-A | Polyimide precursor and photosensitive composition containing the same | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1995-03-14 | — | — | US | disclosed |
| EP-0355927-B1 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | ASAHI CHEMICAL IND (JP) | 1994-11-23 | — | — | EP | disclosed |
| EP-0304136-B1 | Novel photosensitive composition | ASAHI CHEMICAL IND (JP) | 1994-06-29 | — | — | EP | disclosed |
| WO-1994006057-A1 | POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-03-17 | — | — | WO | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
| US-5019482-A | Polymer/oxime ester/coumarin compound photosensitive composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1991-05-28 | — | — | US | disclosed |
| EP-0304136-A2 | Novel photosensitive composition | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1989-02-22 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | FAAH 3006/4885MGLL 3684/4885MEN1 3372/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | FAAH 3674/4885MGLL 4248/4885MEN1 2775/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | FAAH 3567/4885MGLL 3861/4885MEN1 2602/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.