Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SIGMAR1 | Q99720 | 12/20 | 0.42 |
| ▸ | IDO1 | P14902 | 1/20 | 0.41 |
| ▸ | PPARG | P37231 | 1/20 | 0.41 |
| ▸ | PPARA | Q07869 | 1/20 | 0.41 |
| ▸ | FKBP1A | P62942 | 1/20 | 0.40 |
| ▸ | MAOA | P21397 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482080 | 0.89 | SLC6A2 (0.40) | SIGMAR1PPARGPPARAMAOA | |
| SCHEMBL3482058 | 0.82 | CTSK (0.43) | SIGMAR1PPARG | |
| SCHEMBL3482737 | 0.82 | EPHX1 (0.48) | SIGMAR1MAOA | |
| SCHEMBL3481657 | 0.81 | KCNH2 (0.45) | SIGMAR1 | |
| SCHEMBL3481956 | 0.80 | KCNH2 (0.47) | SIGMAR1 | |
| SCHEMBL3342120 | 0.76 | SIGMAR1 (0.43) | SIGMAR1IDO1 | |
| SCHEMBL3482284 | 0.75 | TRPA1 (0.46) | SIGMAR1MAOA | |
| SCHEMBL3815515 | 0.72 | MMP12 (0.41) | SIGMAR1 | |
| SCHEMBL703560 | 0.71 | IDO1 (0.61) | SIGMAR1IDO1MAOA | |
| SCHEMBL8634823 | 0.71 | EPHX1 (0.64) | SIGMAR1MAOA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |