SCHEMBL3482080

SCHEMBL3482080

[SiH3]OC(CCc1ccccc1)Cc1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 2/20 0.40
SLC6A4 P31645 2/20 0.40
SLC6A3 Q01959 2/20 0.40
EPHX1 P07099 1/20 0.40
SIGMAR1 Q99720 4/20 0.39
MME P08473 1/20 0.38
MMP12 P39900 1/20 0.38
ALDH1A1 P00352 1/20 0.38
HPGD P15428 1/20 0.38
ALOX15 P16050 1/20 0.38
ALOX12 P18054 1/20 0.38
CASP1 P29466 1/20 0.38
HSD17B10 Q99714 1/20 0.38
ANPEP P15144 2/20 0.38
ERAP1 Q9NZ08 2/20 0.38
ERAP2 Q6P179 1/20 0.38
PPARG P37231 1/20 0.38
PPARA Q07869 1/20 0.38
MAOA P21397 1/20 0.38
TAAR1 Q96RJ0 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3481810 0.89 SIGMAR1 (0.42) SIGMAR1PPARGPPARAMAOA
SCHEMBL3482737 0.85 EPHX1 (0.48) SLC6A2SLC6A4SLC6A3EPHX1SIGMAR1
SCHEMBL3815515 0.82 MMP12 (0.41) SIGMAR1MMP12
SCHEMBL3482284 0.78 TRPA1 (0.46) SLC6A2SLC6A4SLC6A3EPHX1SIGMAR1
SCHEMBL6950454 0.76 KEAP1 (0.47) MMEMMP12PPARGPPARA
SCHEMBL12630161 0.76 ACE (0.44) EPHX1MMEMMP12ALDH1A1ANPEP
SCHEMBL837629 0.73 TSHR (0.44) ALDH1A1HPGD
SCHEMBL296869 0.73 SMN1; SMN2 (0.41) SLC6A2SLC6A4SLC6A3EPHX1SIGMAR1
SCHEMBL8158327 0.73 ANPEP (0.40) SLC6A2SLC6A4SLC6A3MMEMMP12
SCHEMBL13074081 0.72 MMP12 (0.57) MMP12ALDH1A1HPGDALOX15ALOX12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109641482-B Preparation of cis-1, 4-polydienes having multiple silane functional groups prepared by in situ hydrosilylation of polymer glues 株式会社普利司通 2021-11-05 CN disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-20150251336-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-09-10 US disclosed
US-20150251352-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-09-10 US disclosed
US-20150246483-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, MANUFACTURING METHOD OF THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-09-03 US disclosed
US-20150210016-A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-07-30 US disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed