Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HIF1A | Q16665 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | UQCRB | P14927 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
| ▸ | MGLL | Q99685 | 1/20 | 0.30 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.30 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetraphenylphosphonium SCHEMBL49763 | 0.92 | HIF1A (0.39) | HIF1ACA1CA2MAPTHPGD | |
| Tetraphenylphosphonium SCHEMBL6469728 | 0.85 | UQCRB (0.38) | HIF1ACA1CA2UQCRBMGLL | |
| Tetraphenylphosphonium SCHEMBL6471806 | 0.84 | CA1 (0.41) | HIF1ACA1CA2UQCRBMGLL | |
| Tetraphenylphosphonium SCHEMBL6567177 | 0.82 | HIF1A (0.41) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7176472 | 0.82 | HIF1A (0.41) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL4428554 | 0.82 | HIF1A (0.41) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL20836022 | 0.82 | HTR6 (0.52) | UQCRBMAPTHPGDSMN1; SMN2CYP3A4 | |
| Tetraphenylphosphonium SCHEMBL29362652 | 0.82 | HIF1A (0.50) | HIF1ACA1CA2MAPTHPGD | |
| Tetraphenylphosphonium SCHEMBL8468776 | 0.80 | CA12 (0.50) | HIF1ACA1CA2CYP3A4TDP1 | |
| Phenol SCHEMBL7872891 | 0.80 | ALOX12 (0.43) | CA1CA2MAPTHPGDSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106916270-B | Multi-alkyne compound and preparation method and application thereof | 爱沃特株式会社 | 2020-07-21 | — | — | CN | disclosed |
| CN-106977376-B | Vinylbenzylated phenol compound, active ester resin, thermosetting resin composition, cured product, interlayer insulating material, and prepreg | 爱沃特株式会社 | 2020-06-09 | — | — | CN | disclosed |
| CN-106084184-B | Composition, epoxy resin curing agent, epoxy resin composition, thermosetting composition, cured product, semiconductor device, and interlayer insulating material | 爱沃特株式会社 | 2020-05-01 | — | — | CN | disclosed |
| CN-107614564-B | Thermal expansion modifier, use thereof as thermal expansion modifier, and thermosetting resin composition | 爱沃特株式会社 | 2020-04-14 | — | — | CN | disclosed |
| CN-110770276-A | Composition, epoxy resin curing agent, epoxy resin composition, thermosetting composition, cured product, semiconductor device, and interlayer insulating material | 爱沃特株式会社 | 2020-02-07 | — | — | CN | disclosed |
| CN-101155854-B | Curing-accelerating compound-silica composite, method for producing curing-accelerating compound-silica composite, curing accelerator, curable resin composition, and electronic component device | HITACHI CHEMICAL CO LTD | 2011-09-07 | — | — | CN | disclosed |
| US-7585904-B2 | Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-09-08 | — | — | US | disclosed |
| US-20090012232-A1 | Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| CN-101155854-A | Curing-accelerating compound-silica composite, method for producing curing-accelerating compound-silica composite, curing accelerator, curable resin composition, and electronic component device | HITACHI CHEMICAL CO LTD (JP) | 2008-04-02 | — | — | CN | disclosed |