SCHEMBL431797

SCHEMBL431797

CCCCC(C)C(C)C(C)C(C)=O

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA2 P00918 8/20 0.39
MAPK1 P28482 1/20 0.39
CA1 P00915 6/20 0.38
SLC15A1 P46059 1/20 0.36
FAAH O00519 1/20 0.36
FDPS P14324 1/20 0.35
ACE2 Q9BYF1 1/20 0.34
GPR84 Q9NQS5 2/20 0.33
SLC1A3 P43003 1/20 0.33
SLC1A2 P43004 1/20 0.33
SLC1A1 P43005 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1783613 0.86 CA2 (0.41) CA2MAPK1CA1SLC15A1FAAH
SCHEMBL1781431 0.81 CA2 (0.38) CA2MAPK1CA1SLC15A1FAAH
SCHEMBL1782449 0.80 CA1 (0.48) CA2CA1FAAHFDPSACE2
SCHEMBL19394028 0.78 MEN1 (0.32) CA2MAPK1FDPS
SCHEMBL1782539 0.76 CA2 (0.40) CA2MAPK1CA1SLC15A1FAAH
SCHEMBL4054781 0.76 ABCB1 (0.44) CA2MAPK1CA1SLC15A1FAAH
SCHEMBL13037047 0.75 ACE2 (0.40) CA2MAPK1CA1SLC15A1FAAH
Bicarbonate SCHEMBL6442737 0.74 CA2 (0.52) CA2MAPK1CA1SLC15A1FDPS
SCHEMBL3500277 0.73 CA2 (0.52) CA2MAPK1CA1ACE2GPR84
SCHEMBL6250281 0.73 CA2 (0.52) CA2MAPK1CA1ACE2GPR84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 968 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3558917-B1 NOVEL COMPOUND, SEMICONDUCTOR MATERIAL, AND METHODS FOR MANUFACTURING COATING AND SEMICONDUCTOR USING THE SAME MERCK PATENT GMBH (DE) 2024-01-24 EP claimed
US-11450805-B2 Compound, semiconductor material, and methods for manufacturing coating and semiconductor using the same MERCK PATENT GMBH (DE) 2022-09-20 US claimed
US-20200044158-A1 NOVEL COMPOUND, SEMICONDUCTOR MATERIAL, AND METHODS FOR MANUFACTURING COATING AND SEMICONDUCTOR USING THE SAME MERCK PATENT GMBH (DE) 2020-02-06 US claimed
EP-3558917-A1 NOVEL COMPOUND, SEMICONDUCTOR MATERIAL, AND METHODS FOR MANUFACTURING COATING AND SEMICONDUCTOR USING THE SAME Merck Patent GmbH (DE) 2019-10-30 EP claimed
WO-2018115043-A1 NOVEL COMPOUND, SEMICONDUCTOR MATERIAL, AND METHODS FOR MANUFACTURING COATING AND SEMICONDUCTOR USING THE SAME MERCK PATENT GMBH (DE) 2018-06-28 WO claimed
EP-4747233-A2 COMPOUNDS, COMPOSITIONS CONTAINING COMPOUNDS, AND METHODS OF MANUFACTURING RESIST MEMBRANES Merck Patent GmbH (DE) 2026-05-27 EP disclosed
US-12629718-B2 Film forming method and article manufacturing method CANON KABUSHIKI KAISHA (JP) 2026-05-19 US disclosed
US-20260133493-A1 RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND METHOD FOR PRODUCING THE POLYMER, AND COMPOUND JSR CORPORATION (JP) 2026-05-14 US disclosed
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
US-20260118757-A1 RADIATION-SENSITIVE RESIST COMPOSITION AND PATTERN FORMATION METHOD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-30 US disclosed
US-20260118751-A1 ORGANOMETALLIC COMPOUND, RESIST COMPOSITION COMPRISING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-30 US disclosed
US-20260110966-A1 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-23 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1099719-A1 Diyne-containing (co) polymer, processes for producing the same, and cured film JSR Corporation (JP) 2001-05-16 EP disclosed
EP-1090967-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-11 EP disclosed
EP-1088868-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-04 EP disclosed
EP-1058274-A1 Composition for film formation and material for insulating film formation JSR Corporation (JP) 2000-12-06 EP disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
US-4835445-A Fluorescent display device FUTABA DENSHI KOGHO K.K. (JP) 1989-05-30 US disclosed
US-4012554-A Single coating record system-solvent loss produces color NCR CORPORATION (US) 1977-03-15 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (8 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260110966-A1 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION RER1, SMC2, SMC1A CA2 3520/4885MAPK1 1908/4885CA1 2684/4885
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM SRSF1, MACF1, SRPK1 CA2 3173/4885MAPK1 2597/4885CA1 967/4885
US-11450805-B2 Compound, semiconductor material, and methods for manufacturing coating and semiconductor using the same TYR, CD99, SRM CA2 4584/4885MAPK1 3361/4885CA1 3060/4885
US-12629718-B2 Film forming method and article manufacturing method AUP1, VCL, RHOA CA2 3838/4885MAPK1 4519/4885CA1 2152/4885
US-20260118757-A1 RADIATION-SENSITIVE RESIST COMPOSITION AND PATTERN FORMATION METHOD USING THE SAME SLC39A14, HCN4, SLC11A2 CA2 197/4885MAPK1 1991/4885CA1 813/4885
US-20200044158-A1 NOVEL COMPOUND, SEMICONDUCTOR MATERIAL, AND METHODS FOR MANUFACTURING COATING AND SEMICONDUCTOR USING THE SAME TYR, TRPA1, CD99 CA2 4598/4885MAPK1 3649/4885CA1 3072/4885
US-20260118751-A1 ORGANOMETALLIC COMPOUND, RESIST COMPOSITION COMPRISING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION LBR, RER1, MNS1 CA2 2665/4885MAPK1 1790/4885CA1 2274/4885
US-20260133493-A1 RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND METHOD FOR PRODUCING THE POLYMER, AND COMPOUND RAD51, RAD1, MRE11 CA2 2822/4885MAPK1 2591/4885CA1 1145/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.