Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.57 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.57 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.57 |
| ▸ | TP53 | P04637 | 1/20 | 0.57 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.57 |
| ▸ | TSHR | P16473 | 1/20 | 0.57 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.57 |
| ▸ | PPARG | P37231 | 2/20 | 0.47 |
| ▸ | PPARD | Q03181 | 2/20 | 0.47 |
| ▸ | PPARA | Q07869 | 1/20 | 0.47 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.43 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.43 |
| ▸ | AR | P10275 | 1/20 | 0.43 |
| ▸ | TRPM8 | Q7Z2W7 | 1/20 | 0.43 |
| ▸ | GABRA1 | P14867 | 3/20 | 0.39 |
| ▸ | GABRB2 | P47870 | 3/20 | 0.39 |
| ▸ | XDH | P47989 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 3/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 3/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL436630 | 0.81 | ALDH1A1 (0.48) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL5493559 | 0.81 | ALDH1A1 (0.36) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL28578588 | 0.78 | ALDH1A1 (0.46) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL675673 | 0.78 | ALDH1A1 (0.46) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL3683779 | 0.77 | ALDH1A1 (0.52) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL20584032 | 0.76 | LTA4H (0.41) | ALDH1A1CYP3A4SMN1; SMN2TSHRKMT2A | |
| SCHEMBL173301 | 0.75 | ALDH1A1 (0.64) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL50828 | 0.75 | KDM4E (0.32) | ALDH1A1SMN1; SMN2KDM4EMAPK1 | |
| SCHEMBL28588169 | 0.74 | ALDH1A1 (0.42) | ALDH1A1CYP3A4SMN1; SMN2TP53ALOX15 | |
| SCHEMBL3098802 | 0.74 | TP53 (0.40) | ALDH1A1SMN1; SMN2TP53TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8101703-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD (TW) | 2012-01-24 | — | — | US | claimed |
| US-20100297455-A1 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE | ETERNAL CHEMICAL CO., LTD. | 2010-11-25 | — | — | US | claimed |
| US-7790828-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. (CN) | 2010-09-07 | — | — | US | claimed |
| CN-100494278-C | Precusor solution of polyimide/silicon oxide composite its preparation process and manufactured composite material | CHANGXING CHEMICAL INDUSTRY CO (CN) | 2009-06-03 | — | — | CN | claimed |
| CN-1693367-A | Forward solution of polyimide/silicon oxide composite its preparation process and manufactured composite from same | CHANGXING CHEMICAL INDUSTRY CO (CN) | 2005-11-09 | — | — | CN | claimed |
| US-20050245715-A1 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. | 2005-11-03 | — | — | US | claimed |
| CN-112979876-B | Branched conjugated diene polymer and method for producing same, method for producing rubber composition, and method for producing tire | 旭化成株式会社 | 2023-09-08 | — | — | CN | disclosed |
| CN-112979876-A | Branched conjugated diene polymer, method for producing same, method for producing rubber composition, and method for producing tire | 旭化成株式会社 | 2021-06-18 | — | — | CN | disclosed |
| CN-104245846-A | Polysiloxane composition having radical-crosslinkable group | ASAHI KASEI E MATERIALS CORP | 2014-12-24 | — | — | CN | disclosed |
| CN-103765313-A | Photosensitive alkali-soluble silicone resin composition | ASAHI KASEI E MATERIALS CORP | 2014-04-30 | — | — | CN | disclosed |
| CN-101965542-B | Photosensitive polyorganosiloxane composition | ASAHI KASEI E MATERIALS CORP | 2013-03-27 | — | — | CN | disclosed |
| US-8217388-B2 | Curable organopolysiloxane composition and semiconductor device | DOW CORNING TORAY COMPANY, LTD. (JP) | 2012-07-10 | — | — | US | disclosed |
| US-8101703-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD (TW) | 2012-01-24 | — | — | US | disclosed |
| US-20080262158-A1 | Dimethylvinylsilanol-endcapped polymethylphenylsiloxane, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, platinum catalyst; two-stage thermal curing; high refractive index, light transmittance, adhesion, especially to thermoplastic resins | DOW CORNING TORAY CO., LTD. (JP) | 2008-10-23 | — | — | US | disclosed |
| EP-1781741-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER | DOW CORNING TORAY CO LTD (JP) | 2008-08-27 | — | — | EP | disclosed |
| WO-2008023537-A1 | CURABLE ORGNOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD (JP) | 2008-02-28 | — | — | WO | disclosed |
| EP-1781741-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER | Dow Corning Toray Co., Ltd. (JP) | 2007-05-09 | — | — | EP | disclosed |
| WO-2006011676-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER | DOW CORNING TORAY CO., LTD. (JP) | 2006-02-02 | — | — | WO | disclosed |
| CN-1693367-A | Forward solution of polyimide/silicon oxide composite its preparation process and manufactured composite from same | CHANGXING CHEMICAL INDUSTRY CO (CN) | 2005-11-09 | — | — | CN | disclosed |
| US-20050245715-A1 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. | 2005-11-03 | — | — | US | disclosed |