SCHEMBL445107

SCHEMBL445107

CCCCC(CCC)OOC(C)=O

nearest known ligand 0.40

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CTSK P43235 2/20 0.40
ALDH1A1 P00352 1/20 0.39
CA2 P00918 6/20 0.37
CA1 P00915 3/20 0.37
MAPK1 P28482 1/20 0.36
PRKCA P17252 2/20 0.34
PRKCD Q05655 1/20 0.34
FDPS P14324 1/20 0.33
PLA2G2C Q5R387 1/20 0.33
ACHE P22303 1/20 0.33
BACE1 P56817 1/20 0.33
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
ATM Q13315 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL445367 0.92 HDAC1 (0.37) CTSKALDH1A1PRKCAPRKCDFDPS
SCHEMBL445105 0.88 CA2 (0.41) CTSKALDH1A1CA2CA1MAPK1
SCHEMBL443489 0.83 PRKCA (0.38) CTSKALDH1A1CA2CA1MAPK1
SCHEMBL4834768 0.79 CTSK (0.50) CTSKALDH1A1CA2CA1MAPK1
SCHEMBL27507236 0.78 MAPT (0.50) ALDH1A1MAPK1PRKCAPRKCDCYP3A4
SCHEMBL448883 0.78 FAAH (0.42) ALDH1A1CA2CA1MAPK1FDPS
SCHEMBL28504041 0.77 CA2 (0.38) CTSKALDH1A1CA2CA1MAPK1
SCHEMBL30438549 0.77 CTSK (0.33) CTSKCA2CA1
Acetic Acid SCHEMBL28428166 0.75 CTSK (0.46) CTSKALDH1A1CA2CA1MAPK1
SCHEMBL3369465 0.74 GPR84 (0.39) CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-10134606-B2 Method of forming patterns and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-20 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-20160233083-A1 METHOD OF FORMING MICROPATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-11 US disclosed
US-20150340246-A1 METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-11-26 US disclosed
US-8986554-B2 Method of forming patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-03-24 US disclosed
US-20130295772-A1 METHOD OF FORMING PATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-11-07 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed