SCHEMBL445105

SCHEMBL445105

CCCCC(CC)OOC(C)=O

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA2 P00918 8/20 0.41
CA1 P00915 4/20 0.41
MAPK1 P28482 1/20 0.41
PRKCA P17252 1/20 0.41
PRKCD Q05655 1/20 0.41
CTSK P43235 2/20 0.40
ALDH1A1 P00352 2/20 0.39
TSHR P16473 3/20 0.37
CYP3A4 P08684 1/20 0.37
ATM Q13315 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL445107 0.88 CTSK (0.40) CA2CA1MAPK1PRKCAPRKCD
SCHEMBL443489 0.88 PRKCA (0.38) CA2CA1MAPK1PRKCAPRKCD
SCHEMBL445609 0.83 ALDH1A1 (0.38) ALDH1A1TSHRTDP1
SCHEMBL125718 0.79 PRKCA (0.50) CA2CA1MAPK1PRKCAPRKCD
SCHEMBL7518686 0.79 PRKCA (0.50) CA2CA1MAPK1PRKCAPRKCD
SCHEMBL7520665 0.79 PRKCA (0.50) CA2CA1MAPK1PRKCAPRKCD
SCHEMBL445367 0.79 HDAC1 (0.37) PRKCAPRKCDCTSKALDH1A1TSHR
SCHEMBL448883 0.78 FAAH (0.42) CA2CA1MAPK1ALDH1A1
SCHEMBL10765248 0.76 PRKCA (0.41) CA2CA1MAPK1PRKCAPRKCD
Bicarbonate SCHEMBL8027597 0.75 GPR84 (0.47) CA2CA1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-10134606-B2 Method of forming patterns and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-20 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-20160233083-A1 METHOD OF FORMING MICROPATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-11 US disclosed
US-20150340246-A1 METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-11-26 US disclosed
US-8986554-B2 Method of forming patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-03-24 US disclosed
US-20130295772-A1 METHOD OF FORMING PATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-11-07 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed