SCHEMBL445367

SCHEMBL445367

CCCC(CCC)OOC(C)=O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 2/20 0.37
HDAC2 Q92769 2/20 0.37
CHRM1 P11229 1/20 0.37
AKR1A1 P14550 1/20 0.37
CHRM3 P20309 1/20 0.37
HTR2A P28223 1/20 0.37
HTR2C P28335 1/20 0.37
ADRA1A P35348 1/20 0.37
HRH1 P35367 1/20 0.37
DRD3 P35462 1/20 0.37
SLC6A3 Q01959 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
CYP3A4 P08684 2/20 0.36
TSHR P16473 2/20 0.36
NFKB1 P19838 2/20 0.36
NPSR1 Q6W5P4 2/20 0.36
ALDH1A1 P00352 2/20 0.35
LMNA P02545 1/20 0.35
HSD17B10 Q99714 1/20 0.35
HDAC7 Q8WUI4 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL445107 0.92 CTSK (0.40) TDP1CYP3A4TSHRALDH1A1CTSK
SCHEMBL443489 0.91 PRKCA (0.38) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL445609 0.80 ALDH1A1 (0.38) TDP1TSHRALDH1A1LMNAHSD17B10
SCHEMBL442955 0.79 CHRM1 (0.36) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL445105 0.79 CA2 (0.41) TDP1CYP3A4TSHRALDH1A1CTSK
SCHEMBL19411253 0.77 GRIK1 (0.35) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL19385447 0.75 PRKCA (0.34) TSHRALDH1A1LMNAHSD17B10PRKCA
SCHEMBL4838071 0.75 TSHR (0.43) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL649478 0.73 CHRM1 (0.31) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL282321 0.71 PRKCA (0.47) HDAC1HDAC2CHRM1AKR1A1CHRM3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-10134606-B2 Method of forming patterns and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-20 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-20160233083-A1 METHOD OF FORMING MICROPATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-11 US disclosed
US-20150340246-A1 METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-11-26 US disclosed
US-8986554-B2 Method of forming patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-03-24 US disclosed
US-20130295772-A1 METHOD OF FORMING PATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-11-07 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed