SCHEMBL472102

SCHEMBL472102

C=CCOc1c(C)cc(-c2cc(C)c(OCC=C)c(C)c2)cc1C

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 3/20 0.38
PTGS2 P35354 3/20 0.38
GAA P10253 3/20 0.38
MGAM O43451 2/20 0.38
SI P14410 2/20 0.38
MGAM2 Q2M2H8 2/20 0.38
ALDH1A1 P00352 4/20 0.37
HPGD P15428 2/20 0.37
HSD17B10 Q99714 1/20 0.36
MAPT P10636 3/20 0.36
LMNA P02545 2/20 0.36
NPSR1 Q6W5P4 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
CA12 O43570 1/20 0.34
CA9 Q16790 1/20 0.34
TLR4 O00206 1/20 0.34
KDM4E B2RXH2 2/20 0.33
CXCR5 P32302 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8161008 0.87 POLB (0.39) PTGS1PTGS2GAAALDH1A1HPGD
SCHEMBL262332 0.83 MEN1 (0.41) PTGS1PTGS2GAAMGAMSI
SCHEMBL14394607 0.83 ALDH1A1 (0.36) PTGS1PTGS2GAAMGAMSI
SCHEMBL12299699 0.83 PTGS1 (0.36) PTGS1PTGS2GAAMGAMSI
SCHEMBL5866769 0.82 PTGS1 (0.35) PTGS1PTGS2GAAMGAMSI
SCHEMBL18539815 0.82 POLB (0.38) PTGS1PTGS2GAAMGAMSI
SCHEMBL13483224 0.82 PTGS1 (0.35) PTGS1PTGS2GAAMGAMSI
SCHEMBL5082696 0.82 FFAR4 (0.40) PTGS1PTGS2GAAALDH1A1HPGD
SCHEMBL20271929 0.80 SRC (0.47) PTGS1PTGS2GAAALDH1A1HPGD
SCHEMBL28101612 0.79 PTGS1 (0.36) PTGS1PTGS2GAAMGAMSI

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240327572-A1 CURABLE RESIN COMPOSITION, VARNISH, PREPREG, AND CURED PRODUCT HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2024-10-03 US claimed
WO-2023026845-A1 CURABLE RESIN COMPOSITION, VARNISH, PREPREG, CURED PRODUCT 本州化学工業株式会社 2023-03-02 WO claimed
EP-2383264-B1 EPOXY COMPOUND PRODUCTION METHOD SHOWA DENKO KK (JP) 2015-03-04 EP claimed
US-8664414-B2 Process for producing epoxy compound SHOWA DENKO K.K. (JP) 2014-03-04 US claimed
US-8536352-B2 Method of producing epoxy compounds SHOWA DENKO K.K. (JP) 2013-09-17 US claimed
US-20120029217-A1 PROCESS FOR PRODUCING EPOXY COMPOUND SHOWA DENKO K.K. (JP) 2012-02-02 US claimed
EP-2412712-A1 METHOD FOR PRODUCING EPOXY COMPOUND Showa Denko K.K. (JP) 2012-02-01 EP claimed
EP-2383264-A1 EPOXY COMPOUND PRODUCTION METHOD Showa Denko K.K. (JP) 2011-11-02 EP claimed
US-20110263882-A1 METHOD OF PRODUCING EPOXY COMPOUNDS SHOWA DENKO K.K. (JP) 2011-10-27 US claimed
US-20240327572-A1 CURABLE RESIN COMPOSITION, VARNISH, PREPREG, AND CURED PRODUCT HONSHU CHEMICAL INDUSTRY CO., LTD. (JP) 2024-10-03 US disclosed
US-11773207-B2 Thiol compound, method for synthesizing same, and uses for said thiol compound SHIKOKU CHEMICALS CORPORATION (JP) 2023-10-03 US disclosed
US-11773207-B2 Thiol compound, method for synthesizing same, and uses for said thiol compound SHIKOKU CHEMICALS CORPORATION (JP) 2023-10-03 US disclosed
WO-2023026845-A1 CURABLE RESIN COMPOSITION, VARNISH, PREPREG, CURED PRODUCT 本州化学工業株式会社 2023-03-02 WO disclosed
WO-2020145111-A1 THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND 四国化成工業株式会社 2020-07-16 WO disclosed
US-8664414-B2 Process for producing epoxy compound SHOWA DENKO K.K. (JP) 2014-03-04 US disclosed
US-8536352-B2 Method of producing epoxy compounds SHOWA DENKO K.K. (JP) 2013-09-17 US disclosed
US-20120029217-A1 PROCESS FOR PRODUCING EPOXY COMPOUND SHOWA DENKO K.K. (JP) 2012-02-02 US disclosed
EP-2412712-A1 METHOD FOR PRODUCING EPOXY COMPOUND Showa Denko K.K. (JP) 2012-02-01 EP disclosed
EP-2383264-A1 EPOXY COMPOUND PRODUCTION METHOD Showa Denko K.K. (JP) 2011-11-02 EP disclosed
US-20110263882-A1 METHOD OF PRODUCING EPOXY COMPOUNDS SHOWA DENKO K.K. (JP) 2011-10-27 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120029217-A1 PROCESS FOR PRODUCING EPOXY COMPOUND NOX4, NOX5, NOXO1 PTGS1 233/4885PTGS2 160/4885GAA 3695/4885
US-20110263882-A1 METHOD OF PRODUCING EPOXY COMPOUNDS AOX1, NOX4, AOC2 PTGS1 490/4885PTGS2 316/4885GAA 3773/4885
US-11773207-B2 Thiol compound, method for synthesizing same, and uses for said thiol compound TST, TMT1A, CTH PTGS1 121/4885PTGS2 78/4885GAA 4132/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.