SCHEMBL49445

SCHEMBL49445

C1=C(NC2=CCCC2)CCC1

nearest known ligand 0.36

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 2/20 0.36
HDAC2 Q92769 2/20 0.36
HDAC8 Q9BY41 2/20 0.36
HDAC6 Q9UBN7 2/20 0.36
HDAC3 O15379 1/20 0.36
HDAC1 Q13547 1/20 0.36
HDAC7 Q8WUI4 1/20 0.36
HDAC5 Q9UQL6 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49260 0.91 HDAC4 (0.38) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL7803142 0.88 HDAC4 (0.37) HDAC4HDAC2HDAC8HDAC6
SCHEMBL1485619 0.88 HDAC4 (0.37) HDAC4HDAC2HDAC8HDAC6
SCHEMBL8474760 0.88 HDAC4 (0.37) HDAC4HDAC2HDAC8HDAC6
SCHEMBL1485620 0.88 HDAC4 (0.37) HDAC4HDAC2HDAC8HDAC6
SCHEMBL9934647 0.83
SCHEMBL1485940 0.78 HSD17B10 (0.46)
SCHEMBL12335600 0.77
SCHEMBL1485611 0.77
SCHEMBL10588329 0.75 MAPT (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11916195-B2 Electrolyte solution, electrochemical device, lithium ion secondary battery, and module DAIKIN INDUSTRIES, LTD. (JP) 2024-02-27 US disclosed
US-11916195-B2 Electrolyte solution, electrochemical device, lithium ion secondary battery, and module DAIKIN INDUSTRIES, LTD. (JP) 2024-02-27 US disclosed
EP-4129973-A1 LITHIUM SULFAMATE DERIVATIVES Daikin Industries, Ltd. (JP) 2023-02-08 EP disclosed
US-20220149433-A1 COMPOUND, ELECTROLYTIC SOLUTION ADDITIVE, ELECTROLYTIC SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM ION SECONDARY BATTERY, AND MODULE DAIKIN INDUSTRIES, LTD. (JP) 2022-05-12 US disclosed
EP-3932928-A1 COMPOUND, ELECTROLYTIC SOLUTION ADDITIVE, ELECTROLYTIC SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM ION SECONDARY BATTERY, AND MODULE DAIKIN INDUSTRIES, LTD. (JP) 2022-01-05 EP disclosed
US-20210399344-A1 ELECTROLYTIC SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM-ION SECONDARY BATTERY, MODULE AND COMPOUND DAIKIN INDUSTRIES, LTD. (JP) 2021-12-23 US disclosed
US-20210391597-A1 ELECTROLYTE SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM ION SECONDARY BATTERY, AND MODULE DAIKIN INDUSTRIES, LTD. (JP) 2021-12-16 US disclosed
EP-3920302-A1 ELECTROLYTE SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM ION SECONDARY BATTERY, AND MODULE DAIKIN INDUSTRIES, LTD. (JP) 2021-12-08 EP disclosed
US-20210087059-A1 PRODUCTION METHOD FOR LITHIUM SULFAMATE, AND NOVEL LITHIUM SULFAMATE DAIKIN INDUSTRIES, LTD. (JP) 2021-03-25 US disclosed
EP-3778565-A1 PRODUCTION METHOD FOR LITHIUM SULFAMATE, AND NOVEL LITHIUM SULFAMATE DAIKIN INDUSTRIES, LTD. (JP) 2021-02-17 EP disclosed
CN-102436139-A Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, relief printing plate and process for making the same FUJIFILM CORP 2012-05-02 CN disclosed
US-8129467-B2 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2012-03-06 US disclosed
CN-102300719-A Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate 2011-12-28 CN disclosed
US-8013052-B2 Curable resin, production method thereof, epoxy resin composition, and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-09-06 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
US-20090062460-A1 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-03-05 US disclosed
US-20090023855-A1 NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2009-01-22 US disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20220149433-A1 COMPOUND, ELECTROLYTIC SOLUTION ADDITIVE, ELECTROLYTIC SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM ION SECONDARY BATTERY, AND MODULE C1S, RER1, CLIC1 HDAC4 4048/4885HDAC2 1223/4885HDAC8 3510/4885
US-20210087059-A1 PRODUCTION METHOD FOR LITHIUM SULFAMATE, AND NOVEL LITHIUM SULFAMATE SCLY, SULT1A1, SULT2A1 HDAC4 439/4885HDAC2 19/4885HDAC8 752/4885
US-20090062460-A1 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE NCAPH, RAD51, H1-2 HDAC4 1312/4885HDAC2 341/4885HDAC8 1487/4885
US-20210399344-A1 ELECTROLYTIC SOLUTION, ELECTROCHEMICAL DEVICE, LITHIUM-ION SECONDARY BATTERY, MODULE AND COMPOUND C1S, RER1, NDUFA10 HDAC4 3555/4885HDAC2 827/4885HDAC8 2888/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.