SCHEMBL548298

SCHEMBL548298

O=S(=O)(c1ccc(F)cc1)S(=O)(=O)c1ccc(F)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP2 P08253 2/20 0.54
CA1 P00915 2/20 0.54
CA2 P00918 2/20 0.54
MMP1 P03956 1/20 0.54
MMP9 P14780 1/20 0.54
MMP8 P22894 1/20 0.54
MMP13 P45452 1/20 0.54
PKM P14618 2/20 0.52
ALDH1A1 P00352 2/20 0.52
MEN1 O00255 1/20 0.52
KMT2A Q03164 1/20 0.52
SOS1 Q07889 1/20 0.48
F2 P00734 1/20 0.48
PRSS1 P07477 1/20 0.48
PRSS2 P07478 1/20 0.48
PRSS3 P35030 1/20 0.48
PTGS2 P35354 3/20 0.45
PTGS1 P23219 1/20 0.45
KEAP1 Q14145 1/20 0.43
NFE2L2 Q16236 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10191888 0.87 ALDH1A1 (0.54) MMP2CA1CA2MMP1MMP9
SCHEMBL14509444 0.87 ACHE (0.62) CA1CA2ALDH1A1MEN1KMT2A
SCHEMBL14509400 0.85 CA1 (0.43) MMP2CA1CA2MMP1MMP9
SCHEMBL30859078 0.84 CA1 (0.52) MMP2CA1CA2MMP1MMP9
SCHEMBL2121770 0.81 HSD11B1 (0.55) MMP2CA1CA2MMP1MMP9
SCHEMBL4328574 0.81 HSD11B1 (0.55) MMP2CA1CA2MMP1MMP9
SCHEMBL30072318 0.81 HSD11B1 (0.55) MMP2CA1CA2MMP1MMP9
SCHEMBL79787 0.81 HSD11B1 (0.55) MMP2CA1CA2MMP1MMP9
SCHEMBL1346329 0.79 MMP2 (0.52) MMP2CA1CA2MMP1MMP9
SCHEMBL3457995 0.79 MMP2 (0.52) MMP2CA1CA2MMP1MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 114 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250362597-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-27 US disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
CN-119452307-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2025-02-14 CN disclosed
CN-119422108-A Resist composition and method for forming resist film using same 三菱瓦斯化学株式会社 2025-02-11 CN disclosed
US-20240369925-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAID COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-11-07 US disclosed
US-20240369924-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-11-07 US disclosed
CN-117769684-A Resist auxiliary film composition and pattern forming method using the same 三菱瓦斯化学株式会社 2024-03-26 CN disclosed
CN-117716290-A Resist composition and method for forming resist film using the same 三菱瓦斯化学株式会社 2024-03-15 CN disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-20120171379-A1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-07-05 US disclosed
US-20120164575-A1 CYCLIC COMPOUND, MANUFACTURING METHOD THEREFOR, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING A RESIST PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-06-28 US disclosed
US-20120164576-A1 CYCLIC COMPOUND, PROCESS FOR PREPARATION THEREOF, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-06-28 US disclosed
US-20120156615-A1 CYCLIC COMPOUND, PROCESS FOR PRODUCTION OF THE CYCLIC COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-06-21 US disclosed
US-8198007-B2 Negative-working resist composition and pattern forming method using the same DAI NIPPON PRINTING CO., LTD. (JP) 2012-06-12 US disclosed
US-8110334-B2 Radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-02-07 US disclosed
US-7919223-B2 Polyphenol compound synthesized by condensation between aromatic ketone or aldehyde and a phenol; acid-amplified, non-polymeric resist; highly sensitive to KrF excimer lasers, extreme ultraviolet rays, electron beams, X-rays; resist patterns with high resolution, high heat, etch resistance MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2011-04-05 US disclosed
US-20100266952-A1 CYCLIC COMPOUND, PHOTORESIST BASE, PHOTORESIST COMPOSITION, MICROFABRICATION PROCESS, AND SEMICONDUCTOR DEVICE IDEMITSU KOSAN CO., LTD. (JP) 2010-10-21 US disclosed
US-20100239980-A1 NEGATIVE-WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME DAI NIPPON PRINTING CO., LTD. (JP) 2010-09-23 US disclosed
US-20080113294-A1 Compound for Resist and Radiation-Sensitive Composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2008-05-15 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120171379-A1 RADIATION-SENSITIVE COMPOSITION PARG, RAD51, SRMS MMP2 2363/4885CA1 1834/4885CA2 3153/4885
US-20120156615-A1 CYCLIC COMPOUND, PROCESS FOR PRODUCTION OF THE CYCLIC COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN RAD1, CCNE1, CCNA1 MMP2 3859/4885CA1 1531/4885CA2 4687/4885
US-20100266952-A1 CYCLIC COMPOUND, PHOTORESIST BASE, PHOTORESIST COMPOSITION, MICROFABRICATION PROCESS, AND SEMICONDUCTOR DEVICE C1S, CCNL2, CCNT1 MMP2 4416/4885CA1 2257/4885CA2 2323/4885
US-20120164576-A1 CYCLIC COMPOUND, PROCESS FOR PREPARATION THEREOF, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN RAD1, RER1, REV1 MMP2 4290/4885CA1 1807/4885CA2 4834/4885
US-20120164575-A1 CYCLIC COMPOUND, MANUFACTURING METHOD THEREFOR, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING A RESIST PATTERN WEE1, SLC11A2, RAD1 MMP2 4296/4885CA1 2746/4885CA2 4845/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.