Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ENPEP | Q07075 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | TP53 | P04637 | 2/20 | 0.37 |
| ▸ | GMNN | O75496 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | THPO | P40225 | 1/20 | 0.37 |
| ▸ | HBB | P68871 | 1/20 | 0.37 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28554323 | 0.79 | ENPEP (0.48) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL518152 | 0.77 | PTGS1 (0.38) | LMNA | |
| SCHEMBL11551437 | 0.75 | ENPEP (0.45) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL28442818 | 0.75 | ENPEP (0.50) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL4926822 | 0.75 | ENPEP (0.45) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL5481866 | 0.73 | ENPEP (0.43) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL15754444 | 0.71 | ENPEP (0.42) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL15420731 | 0.71 | ENPEP (0.42) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL28026881 | 0.70 | ENPEP (0.52) | ENPEPKDM4EMAPTALOX15ALDH1A1 | |
| SCHEMBL15754666 | 0.70 | ENPEP (0.41) | ENPEPKDM4EMAPTALOX15ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1300487-B1 | Copper plating bath | ROHM & HAAS ELECT MAT (US) | 2017-10-04 | — | — | EP | claimed |
| US-9598787-B2 | Method of filling through-holes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-03-21 | — | — | US | claimed |
| EP-1651801-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH Deutschland GmbH (DE) | 2006-05-03 | — | — | EP | claimed |
| US-20050155866-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2005-07-21 | — | — | US | claimed |
| US-6911068-B2 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-28 | — | — | US | claimed |
| WO-2005014891-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2005-02-17 | — | — | WO | claimed |
| US-20040206631-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-10-21 | — | — | US | claimed |
| US-20040104124-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-06-03 | — | — | US | claimed |
| US-6736954-B2 | A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY | SHIPLEY COMPANY, L.L.C. | 2004-05-18 | — | — | US | claimed |
| US-20040074778-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2004-04-22 | — | — | US | claimed |
| US-20030102226-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-06-05 | — | — | US | claimed |
| US-20030085132-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-05-08 | — | — | US | claimed |
| EP-1308540-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-05-07 | — | — | EP | claimed |
| EP-1308541-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Company LLC (US) | 2003-05-07 | — | — | EP | claimed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | claimed |
| US-20030066756-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-10 | — | — | US | claimed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300487-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300488-A2 | Plating path and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| US-20230279577-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-09-07 | — | — | US | disclosed |
| EP-4239109-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS | Rohm and Haas Electronic Materials LLC (US) | 2023-09-06 | — | — | EP | disclosed |
| CN-116695200-A | Method for filling vias to reduce voids | 罗门哈斯电子材料有限责任公司 | 2023-09-05 | — | — | CN | disclosed |
| US-11686006-B2 | Method of enhancing copper electroplating | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2023-06-27 | — | — | US | disclosed |
| EP-3808877-B1 | METHOD OF ENHANCING COPPER ELECTROPLATING | ROHM & HAAS ELECT MAT (US) | 2023-04-05 | — | — | EP | disclosed |
| US-11512406-B2 | Method of enhancing copper electroplating | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2022-11-29 | — | — | US | disclosed |
| US-20220213610-A1 | PHOTORESIST RESOLUTION CAPABILITIES BY COPPER ELECTROPLATING ANISOTROPICALLY | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2022-07-07 | — | — | US | disclosed |
| US-20210115581-A1 | METHOD OF ENHANCING COPPER ELECTROPLATING | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2021-04-22 | — | — | US | disclosed |
| EP-3808877-A2 | METHOD OF ENHANCING COPPER ELECTROPLATING | Rohm and Haas Electronic Materials LLC (US) | 2021-04-21 | — | — | EP | disclosed |
| EP-3205749-B1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | ROHM & HAAS ELECT MAT (US) | 2020-03-25 | — | — | EP | disclosed |
| EP-3205750-B1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | ROHM & HAAS ELECT MAT (US) | 2019-10-23 | — | — | EP | disclosed |
| US-10154598-B2 | Filling through-holes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-12-11 | — | — | US | disclosed |
| EP-1300487-B1 | Copper plating bath | ROHM & HAAS ELECT MAT (US) | 2017-10-04 | — | — | EP | disclosed |
| US-9780380-B2 | Current collector for battery and secondary battery comprising the same | SK INNOVATION CO., LTD. (KR) | 2017-10-03 | — | — | US | disclosed |
| EP-1300488-B1 | Plating path and method for depositing a metal layer on a substrate | ROHM & HAAS ELECT MAT (US) | 2017-09-27 | — | — | EP | disclosed |
| US-20170238427-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2017-08-17 | — | — | US | disclosed |
| US-20170233886-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2017-08-17 | — | — | US | disclosed |
| EP-3205750-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | Rohm and Haas Electronic Materials LLC (US) | 2017-08-16 | — | — | EP | disclosed |
| EP-3205749-A1 | METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS | Rohm and Haas Electronic Materials LLC (US) | 2017-08-16 | — | — | EP | disclosed |
| US-9598787-B2 | Method of filling through-holes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-03-21 | — | — | US | disclosed |
| EP-1475463-B2 | Reverse pulse plating method | SHIPLEY CO LLC (US) | 2017-03-01 | — | — | EP | disclosed |
| EP-2778261-B1 | Method of filling through-holes | ROHM & HAAS ELECT MAT (US) | 2016-07-06 | — | — | EP | disclosed |
| EP-3009533-A1 | FILLING THROUGH-HOLES | Rohm and Haas Electronic Materials LLC (US) | 2016-04-20 | — | — | EP | disclosed |
| US-20160105975-A1 | FILLING THROUGH-HOLES | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-04-14 | — | — | US | disclosed |
| US-8956523-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-02-17 | — | — | US | disclosed |
| US-8945362-B2 | Plating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-02-03 | — | — | US | disclosed |
| US-20140295238-A1 | CURRENT COLLECTOR FOR BATTERY AND SECONDARY BATTERY COMPRISING THE SAME | SK INNOVATION CO., LTD. (KR) | 2014-10-02 | — | — | US | disclosed |
| US-20140262799-A1 | METHOD OF FILLING THROUGH-HOLES | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-09-18 | — | — | US | disclosed |
| US-20140262801-A1 | METHOD OF FILLING THROUGH-HOLES | ROHM & HAAS ELECT MAT (US) | 2014-09-18 | — | — | US | disclosed |
| EP-2778261-A1 | Method of filling through-holes | Rohm and Haas Electronic Materials LLC (US) | 2014-09-17 | — | — | EP | disclosed |
| EP-2778260-A2 | Method of filling through-holes | Rohm and Haas Electronic Materials LLC (US) | 2014-09-17 | — | — | EP | disclosed |
| US-20140081045-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-03-20 | — | — | US | disclosed |
| EP-1978134-B1 | Metal plating compositions | ROHM & HAAS ELECT MAT (US) | 2013-09-11 | — | — | EP | disclosed |
| US-8337688-B2 | Metal plating compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-12-25 | — | — | US | disclosed |
| US-8329018-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-12-11 | — | — | US | disclosed |
| EP-1978051-B1 | Metal plating compositions and methods | ROHM & HAAS ELECT MAT (US) | 2012-02-22 | — | — | EP | disclosed |
| US-20120034371-A1 | METAL PLATING COMPOSITIONS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-02-09 | — | — | US | disclosed |
| US-20110318479-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-12-29 | — | — | US | disclosed |
| US-8048284-B2 | Mixture of metal compound and polyamideether copolymer; electrical or decorative article; printed circuits; improved leveling and throwing power | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-11-01 | — | — | US | disclosed |
| US-20110253545-A1 | METHOD OF DIRECT ELECTRODEPOSITION ON SEMICONDUCTORS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-10-20 | — | — | US | disclosed |
| US-8012334-B2 | provide good leveling performance and throwing power; additives to improve the brightness, ductility and plating distribution of the metal deposit | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-06 | — | — | US | disclosed |
| EP-1475463-B1 | Reverse pulse plating method | SHIPLEY CO LLC (US) | 2011-03-30 | — | — | EP | disclosed |
| EP-1300486-B1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY CO LLC (US) | 2011-03-16 | — | — | EP | disclosed |
| EP-1598449-B1 | Improved plating method | ROHM & HAAS ELECT MAT (US) | 2010-08-04 | — | — | EP | disclosed |
| EP-1308540-B1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY CO LLC (US) | 2010-01-20 | — | — | EP | disclosed |
| US-7582199-B2 | Metal or metal alloy is deposited on substrate electrolytically; current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-09-01 | — | — | US | disclosed |
| US-20090188804-A1 | Plating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-07-30 | — | — | US | disclosed |
| US-20080269395-A1 | Metal plating compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-10-30 | — | — | US | disclosed |
| US-20080268138-A1 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-10-30 | — | — | US | disclosed |
| EP-1978051-A1 | Metal plating compositions and methods | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-10-08 | — | — | EP | disclosed |
| EP-1978134-A1 | Metal plating compositions | Rohm and Haas Electronic Materials LLC (US) | 2008-10-08 | — | — | EP | disclosed |
| EP-1651801-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH Deutschland GmbH (DE) | 2006-05-03 | — | — | EP | disclosed |
| US-20060081475-A1 | Reverse pulse plating composition and method | SHIPLEY COMPANY, L.L.C. (US) | 2006-04-20 | — | — | US | disclosed |
| US-20060012044-A1 | Plating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-01-19 | — | — | US | disclosed |
| EP-1598449-A2 | Improved plating method | Rohm and Haas Electronic Materials, L.L.C. (US) | 2005-11-23 | — | — | EP | disclosed |
| US-20050155866-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2005-07-21 | — | — | US | disclosed |
| US-20050139118-A1 | Brightener degradation inhibitor compound in copper plating bath | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-30 | — | — | US | disclosed |
| US-6911068-B2 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-28 | — | — | US | disclosed |
| WO-2005014891-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2005-02-17 | — | — | WO | disclosed |
| US-20050016858-A1 | Reverse pulse plating composition and method | SHIPLEY COMPANY, L.L.C. (US) | 2005-01-27 | — | — | US | disclosed |
| EP-1475463-A2 | Reverse pulse plating composition and method | Shipley Company, L.L.C. (US) | 2004-11-10 | — | — | EP | disclosed |
| US-20040206631-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-10-21 | — | — | US | disclosed |
| US-6773573-B2 | ELECTROLYTIC CELLS; BATH MIXTURE CONTAINING ALCOHOLS; STABILITY | SHIPLEY COMPANY, L.L.C. | 2004-08-10 | — | — | US | disclosed |
| US-20040104124-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-06-03 | — | — | US | disclosed |
| US-6736954-B2 | A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY | SHIPLEY COMPANY, L.L.C. | 2004-05-18 | — | — | US | disclosed |
| US-20040074778-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2004-04-22 | — | — | US | disclosed |
| US-6652731-B2 | Comprises 2,3,4-trihydroxybenzaldehyde for inhibiting consumption of plating additives; integrated circuits | SHIPLEY COMPANY, L.L.C. | 2003-11-25 | — | — | US | disclosed |
| US-20030102226-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-06-05 | — | — | US | disclosed |
| US-20030085132-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-05-08 | — | — | US | disclosed |
| EP-1308540-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-05-07 | — | — | EP | disclosed |
| EP-1308541-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Company LLC (US) | 2003-05-07 | — | — | EP | disclosed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | disclosed |
| US-20030066756-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-10 | — | — | US | disclosed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | disclosed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | disclosed |
| EP-1300488-A2 | Plating path and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | disclosed |
| EP-1300487-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | disclosed |