SCHEMBL6467663

SCHEMBL6467663

C=C(C)C(=O)OCC(=O)OC1CC2CC1C1C(=O)OCC21

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10027369 0.87 ALDH1A1 (0.33) ALDH1A1
SCHEMBL304319 0.87 GPX4 (0.33) ALDH1A1
SCHEMBL14838639 0.84 ALDH1A1 (0.34) ALDH1A1
SCHEMBL22236870 0.83 SMN1; SMN2 (0.31)
SCHEMBL10027365 0.80 ALDH1A1 (0.34) ALDH1A1
SCHEMBL9924194 0.80
SCHEMBL9880661 0.80 ALDH1A1 (0.34) ALDH1A1
SCHEMBL12156893 0.79 LMNA (0.38)
SCHEMBL10027358 0.79
SCHEMBL10027368 0.78 ALDH1A1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11874603-B2 Photoresist composition comprising amide compound and pattern formation methods using the same ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2024-01-16 US disclosed
US-11874603-B2 Photoresist composition comprising amide compound and pattern formation methods using the same ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2024-01-16 US disclosed
US-11829069-B2 Photoresist compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-11-28 US disclosed
US-11829069-B2 Photoresist compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-11-28 US disclosed
WO-2023095563-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR株式会社 2023-06-01 WO disclosed
US-20230099348-A1 PHOTORESIST COMPOSITION COMPRISING AMIDE COMPOUND AND PATTERN FORMATION METHODS USING THE SAME DUPONT SPECIALTY MATERIALS KOREA LTD (KR) 2023-03-30 US disclosed
US-11487203-B2 Monomers, polymers and photoresist compositions ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2022-11-01 US disclosed
US-11016388-B2 Overcoat compositions and methods for photolithography ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2021-05-25 US disclosed
US-10921711-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2021-02-16 US disclosed
US-10564542-B2 Photoresist compositions and methods DUPONT SPECIALTY MATERIALS KOREA LTD (KR) 2020-02-18 US disclosed
EP-2492749-A1 Photoresist compositions and methods of forming photolithographic patterns Rohm and Haas Electronic Materials LLC (US) 2012-08-29 EP disclosed
EP-2492750-A1 Photoresist compositions and methods of forming photolithographic patterns Rohm and Haas Electronic Materials LLC (US) 2012-08-29 EP disclosed
US-20120129108-A1 BASE REACTIVE PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-05-24 US disclosed
US-20120129108-A1 BASE REACTIVE PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-05-24 US disclosed
EP-2452932-A2 Base reactive photoacid generators and photoresists comprising same Rohm and Haas Electronic Materials LLC (US) 2012-05-16 EP disclosed
US-20120077120-A1 PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-03-29 US disclosed
US-20120077120-A1 PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-03-29 US disclosed
EP-2428842-A1 Photoresists comprising multi-amide component Rohm and Haas Electronic Materials LLC (US) 2012-03-14 EP disclosed
US-20100081086-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-01 US disclosed
US-20100081086-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-01 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11016388-B2 Overcoat compositions and methods for photolithography OGT, COLGALT1, PARG ALDH1A1 2382/4885
US-10564542-B2 Photoresist compositions and methods PARG, PNN, PARN ALDH1A1 4826/4885
US-11487203-B2 Monomers, polymers and photoresist compositions MAP1LC3C, LCP1, PIN1 ALDH1A1 2061/4885
US-20120129108-A1 BASE REACTIVE PHOTOACID GENERATORS AND PHOTORESISTS COMPRISING SAME ALAD, APEX1, HMBS ALDH1A1 1611/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.